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XCR3384XL-10FG324C
In Stock : 999
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XCR3384XL-10FG324C Overview
In the mobile phone network, there are 384macro cells, which are cells with high-power antennas and towers.FBGAis the package in which it resides.It is programmed with 220 I/Os.324terminations have been programmed into the device.There is a BOTTOMterminal position on the electrical part in question.It is powered from a supply voltage of 3.3V.There is a part included in Programmable Logic Devices.It is packaged in the way of Bulk.A chip with 324pins is programmed.When using this device, YESis also available.A digital circuit is built using 9000gates.In order to achieve high efficiency, the supply voltage should be maintained at [0].For storing data, it is recommended to use [0].Surface Mountis used to mount this electronic component.A total of 324pins are provided on this board.In this case, the maximum supply voltage (Vsup) is 3.6V.It is recommended that the operating temperature exceeds 0°C.A temperature lower than 70°Cis recommended for operation.24logic blocks (LABs) make up this circuit.The maximum frequency should not exceed 102MHz.Programmable logic types can be divided into EE PLD.
XCR3384XL-10FG324C Features
FBGA package
220 I/Os
324 pin count
324 pins
24 logic blocks (LABs)
XCR3384XL-10FG324C Applications
There are a lot of Xilinx XCR3384XL-10FG324C CPLDs applications.
- State machine design
- Address decoding
- Wide Vin Industrial low power SMPS
- ROM patching
- DMA control
- Discrete logic functions
- Random logic replacement
- INTERRUPT SYSTEM
- I2C BUS INTERFACE
- Custom shift registers
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XCR3384XL-10FG324C
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