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XCZU4CG-L1FBVB900I

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Manufacturer No:

XCZU4CG-L1FBVB900I

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU4CG-L1FBVB900I

Package:

900-BBGA, FCBGA

Description:

900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC is built.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq? UltraScale+? MPSoC CG is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 192K+ Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 204 I/Os.For safe operation, it is advisable to utilize a power supply with 0.72V voltage.For the SoCs wireless, a voltage higher than 0.742V is considered unsafe.At least 0.698V can be supplied as a power source.system on a chip benefits from 900 terminations.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU4CG-L1FBVB900I System On Chip (SoC) applications.

  • Remote control
  • Networked sensors
  • Digital Media
  • Communication interfaces ( I2C, SPI )
  • Self-aware system-on-chip (SoC)
  • Three phase UPS
  • Central alarm system
  • Microcontroller based SoC ( RISC-V, ARM)
  • Temperature Sensors
  • ARM support modules
1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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FedEx International, 5-7 business days.
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Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU4CG-L1FBVB900I

technical specifications, attributes, parameters and parts with similar specifications to XCZU4CG-L1FBVB900I.

  • Type
    Parameter
    Select All
  • JESD-30 Code

    R-PBGA-B900

  • Supply Voltage-Max (Vsup)

    0.742V

  • Supply Voltage-Min (Vsup)

    0.698V

  • Number of I/O

    204

  • Speed

    500MHz, 1.2GHz

  • RAM Size

    256KB

  • uPs/uCs/Peripheral ICs Type

    MICROPROCESSOR CIRCUIT

  • Core Processor

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

  • Factory Lead Time

    11 Weeks

  • Package / Case

    900-BBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2016

  • Series

    Zynq® UltraScale+™ MPSoC CG

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    900

  • Additional Feature

    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

  • HTS Code

    8542.31.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    0.72V

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

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