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XC7Z030-1FBG676C

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Manufacturer No:

XC7Z030-1FBG676C

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z030-1FBG676C

Package:

676-BBGA, FCBGA

Datasheet:

XC7Z030-1FBG676C

Description:

676 Terminations0°C~85°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq?-7000 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.It is recommended to use a 1V power supply.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.In total, there are 676 terminations, which makes system on a chip possible.XC7Z030 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is the 676-pin version.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z030-1FBG676C System On Chip (SoC) applications.

  • AC drive control module
  • Industrial AC-DC
  • Industrial automation devices
  • Functional safety for critical applications in the automotive
  • Medical Pressure
  • Functional safety for critical applications in the industrial sectors
  • Robotics
  • Defense
  • AC-input BLDC motor drive
  • Cyberphysical system-on-chip
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z030-1FBG676C

technical specifications, attributes, parameters and parts with similar specifications to XC7Z030-1FBG676C.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Package / Case

    676-BBGA, FCBGA

  • Surface Mount

    YES

  • Number of Pins

    676

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    Zynq®-7000

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    676

  • ECCN Code

    3A991.D

  • Terminal Finish

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • HTS Code

    8542.39.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    245

  • Supply Voltage

    1V

  • Terminal Pitch

    1mm

  • Frequency

    667MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    XC7Z030

  • Operating Supply Voltage

    1V

  • Supply Voltage-Max (Vsup)

    1.05V

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Number of I/O

    130

  • RAM Size

    256KB

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Data Bus Width

    32b

  • Core Architecture

    ARM

  • Boundary Scan

    YES

  • Speed Grade

    -1

  • RAM (words)

    256000

  • Primary Attributes

    Kintex™-7 FPGA, 125K Logic Cells

  • Bus Compatibility

    CAN; ETHERNET; I2C; SPI; UART; USB

  • Height Seated (Max)

    2.54mm

  • Length

    27mm

  • Radiation Hardening

    No

  • RoHS Status

    ROHS3 Compliant

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