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XCV812E-6FG900C

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Manufacturer No:

XCV812E-6FG900C

Manufacturer:

Xilinx

HK JDW NO:

903-XCV812E-6FG900C

Package:

900-BBGA

Datasheet:

XCV812E-6FG900C

Description:

1.8V V FPGAs Virtex?-E EM Series 900-BBGA 1mm mm 900

Quantity:

In Stock : 999

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XCV812E-6FG900C Overview


Fpga chips is supplied in the 900-BBGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The device has 556 I/O ports for more coherent data transfer. There are 21168 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.8V. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. The Virtex?-E EM Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 556 outputs incorporated in this device. In order to save space, this FPGA model has been contained in Tray. As a whole, it has 900 terminations. The RAM bits that this device offer is 1146880. In order to find related parts, use the part number XCV812E as a base. It is crucial that the RAM si140kBe of this FPGA module reaches 140kB so that the program can run normally. The device has 900 pins which are included in the design. The FPGA consists of 4704 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. With a 1.8V supply voltage, designers can fully utilize the flexibility of the device. There are 254016 gates in its basic building block. A total of 900 pins are included in this device. A crystal oscillating at 357MHz is one of the most common components of this device.

XCV812E-6FG900C Features


556 I/Os
Up to 1146880 RAM bits
900 LABs/CLBs

XCV812E-6FG900C Applications


There are a lot of Xilinx Inc. XCV812E-6FG900C FPGAs applications.

  • Wired Communications
  • Military DSP
  • Medical Electronics
  • Wireless Communications
  • Medical ultrasounds
  • Video & Image Processing
  • Digital signal processing
  • Device controllers
  • Ecosystem
  • Automotive advanced driver assistance systems (ADAS)
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Package

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Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
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Step5Bar-code shipping tag

XCV812E-6FG900C

technical specifications, attributes, parameters and parts with similar specifications to XCV812E-6FG900C.

  • Type
    Parameter
    Select All
  • Mount

    Surface Mount

  • Mounting Type

    Surface Mount

  • Package / Case

    900-BBGA

  • Number of Pins

    900

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2002

  • Series

    Virtex®-E EM

  • JESD-609 Code

    e0

  • Pbfree Code

    no

  • Part Status

    Obsolete

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    900

  • ECCN Code

    3A991.D

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Voltage - Supply

    1.71V~1.89V

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    225

  • Supply Voltage

    1.8V

  • Terminal Pitch

    1mm

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    XCV812E

  • Pin Count

    900

  • Number of Outputs

    556

  • Operating Supply Voltage

    1.8V

  • Number of I/O

    556

  • RAM Size

    140kB

  • Clock Frequency

    357MHz

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Number of Logic Elements/Cells

    21168

  • Total RAM Bits

    1146880

  • Number of Gates

    254016

  • Number of LABs/CLBs

    4704

  • Speed Grade

    6

  • Combinatorial Delay of a CLB-Max

    0.47 ns

  • Length

    31mm

  • Width

    31mm

  • Radiation Hardening

    No

  • RoHS Status

    Non-RoHS Compliant

  • Lead Free

    Contains Lead

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