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XC7Z045-3FBG676E

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Manufacturer No:

XC7Z045-3FBG676E

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z045-3FBG676E

Package:

676-BBGA, FCBGA

Datasheet:

XC7Z045-3FBG676E

Description:

676 Terminations0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.In total, there are 676 terminations, which is great for system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.There are a number of features to this SoC meaning which are based on the core architecture of ARM.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-3FBG676E System On Chip (SoC) applications.

  • Efficient hardware for training of neural networks
  • PC peripherals
  • Medical
  • Temperature Sensors
  • Robotics
  • Central inverter
  • Functional safety for critical applications in the industrial sectors
  • Medical Pressure
  • Personal Computers
  • Networked Media Encode/Decode
1. Purchase

You can send an inquiry by email, or add the item to the RFQ list and submit it to us.
Tell us the model and quantity you need, our sales staff will reply the price in time.
EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z045-3FBG676E

technical specifications, attributes, parameters and parts with similar specifications to XC7Z045-3FBG676E.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Package / Case

    676-BBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~100°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    Zynq®-7000

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    676

  • ECCN Code

    3A991.D

  • Terminal Finish

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • HTS Code

    8542.39.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    245

  • Supply Voltage

    1V

  • Terminal Pitch

    1mm

  • Frequency

    1GHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    XC7Z045

  • JESD-30 Code

    S-PBGA-B676

  • Operating Supply Voltage

    1V

  • Supply Voltage-Max (Vsup)

    1.05V

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Number of I/O

    130

  • RAM Size

    256KB

  • Memory Type

    ROMless

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Data Bus Width

    32b

  • Core Architecture

    ARM

  • Boundary Scan

    YES

  • Speed Grade

    -3

  • RAM (words)

    256000

  • Primary Attributes

    Kintex™-7 FPGA, 350K Logic Cells

  • Bus Compatibility

    CAN; ETHERNET; I2C; SPI; UART; USB

  • Height Seated (Max)

    2.54mm

  • Length

    27mm

  • Radiation Hardening

    No

  • RoHS Status

    ROHS3 Compliant

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