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  • LFXP2-30E-6FT256I

LFXP2-30E-6FT256I

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Manufacturer No:

LFXP2-30E-6FT256I

Manufacturer:

Lattice Semiconductor

HK JDW NO:

477-LFXP2-30E-6FT256I

Package:

256-LBGA

Datasheet:

LFXP2-30E-6FT256I

Description:

1.2V V 55.4kB B FPGAs XP2 Series 256-LBGA

Quantity:

In Stock : 999

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LFXP2-30E-6FT256I Overview


A 256-LBGA package contains it, and it is available for download. This device features 201 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 29000 logic elements/cells are required. The Surface Mount-slot connector on the FPGA module can be connected to the development board. The supply voltage of the device is 1.14V~1.26V , at which it runs. It is a type of FPGA belonging to the XP2 seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. It is for space saving reasons that this FPGA model is contained in Tray. A device like this one offers 396288 RAM bits, which is a considerable amount of memory. In order to find related parts, use the part number LFXP2-30 as a base. The FPGA module's RAM si48.4kBe reaches 48.4kB in order to ensure that the program operates in a normal manner. Fpga electronics is designed wfpga electronics h 256 pins. The FPGA is built as an array of 3625 latches or CLBs. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Featuring 256 pins in total, it is a versatile device. In this FPGA module, there is a memory of 55.4kB available for storing applications and data.

LFXP2-30E-6FT256I Features


201 I/Os
Up to 396288 RAM bits
256 LABs/CLBs

LFXP2-30E-6FT256I Applications


There are a lot of Lattice Semiconductor Corporation LFXP2-30E-6FT256I FPGAs applications.

  • Ecosystem
  • Space Applications
  • Military Temperature
  • Distributed Monetary Systems
  • Secure Communication
  • Defense Applications
  • Data Mining
  • Software-defined radio
  • Automotive driver's assistance
  • Wireless Communications
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Package

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Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
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LFXP2-30E-6FT256I

technical specifications, attributes, parameters and parts with similar specifications to LFXP2-30E-6FT256I.

  • Type
    Parameter
    Select All
  • Mount

    Surface Mount

  • Mounting Type

    Surface Mount

  • Package / Case

    256-LBGA

  • Number of Pins

    256

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2012

  • Series

    XP2

  • Pbfree Code

    no

  • Part Status

    Obsolete

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • ECCN Code

    EAR99

  • HTS Code

    8542.39.00.01

  • Voltage - Supply

    1.14V~1.26V

  • Reach Compliance Code

    not_compliant

  • Base Part Number

    LFXP2-30

  • Pin Count

    256

  • Operating Supply Voltage

    1.2V

  • Memory Size

    55.4kB

  • Number of I/O

    201

  • RAM Size

    48.4kB

  • Number of Logic Elements/Cells

    29000

  • Total RAM Bits

    396288

  • Number of LABs/CLBs

    3625

  • RoHS Status

    Non-RoHS Compliant

  • Lead Free

    Lead Free

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