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  • EP3C25F324C6

EP3C25F324C6

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Manufacturer No:

EP3C25F324C6

Manufacturer:

Intel

HK JDW NO:

386-EP3C25F324C6

Package:

324-BGA

Datasheet:

EP3C25F324C6

Description:

1.9mm mm FPGAs Cyclone? III Series 324-BGA 1mm mm 324

Quantity:

In Stock : 999

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Product Details

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EP3C25F324C6 Overview


This package is included in the 324-BGA package and is available for purchase. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 215 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 24624 logic elements/cells. It is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 1.15V~1.25V . It is a type of FPGA that belongs to the Cyclone? III series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. This device is equipped with 215 separate outputs, which makes it a very versatile device. As a space-saving measure, this FPGA model is contained within Tray. 324 terminations are present in total. This device has 608256 RAM bits, which is the number of RAM bits that this device offers. Its base part number EP3C25 can be used to find parts that are related to it. 1539 LABs/CLBs are configured on this FPGA. Most of the time, it uses a crystal oscillating at 472.5MHz to generate the signal.

EP3C25F324C6 Features


215 I/Os
Up to 608256 RAM bits

EP3C25F324C6 Applications


There are a lot of Intel EP3C25F324C6 FPGAs applications.

  • Data center hardware accelerators
  • Medical Electronics
  • Secure Communication
  • Device controllers
  • Aircraft navigation
  • Solar Energy
  • Integrating multiple SPLDs
  • OpenCL
  • Audio
  • Automotive Applications
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

EP3C25F324C6

technical specifications, attributes, parameters and parts with similar specifications to EP3C25F324C6.

  • Type
    Parameter
    Select All
  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Series

    Cyclone® III

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    324

  • ECCN Code

    3A991

  • Terminal Finish

    TIN LEAD

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Voltage - Supply

    1.15V~1.25V

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    220

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1mm

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    EP3C25

  • JESD-30 Code

    S-PBGA-B324

  • Number of Outputs

    215

  • Qualification Status

    Not Qualified

  • Number of I/O

    215

  • Clock Frequency

    472.5MHz

  • Number of Inputs

    215

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Number of Logic Elements/Cells

    24624

  • Total RAM Bits

    608256

  • Number of LABs/CLBs

    1539

  • Height Seated (Max)

    1.9mm

  • Length

    19mm

  • Width

    19mm

  • RoHS Status

    RoHS Compliant

  • Factory Lead Time

    8 Weeks

  • Mounting Type

    Surface Mount

  • Package / Case

    324-BGA

  • Surface Mount

    YES

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