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A2F500M3G-FG484M

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Manufacturer No:

A2F500M3G-FG484M

Manufacturer:

Microsemi

HK JDW NO:

523-A2F500M3G-FG484M

Package:

484-BGA

Datasheet:

A2F500M3G-FG484M

Description:

484 Terminations-55°C~125°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion? series.Temperatures should be -55°C~125°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of MCU - 41, FPGA - 128 I/Os.Ideally, a power supply with a voltage of 1.5V should be used.In the SoCs wireless, voltages above 1.575V are considered unsafe.If it has at least a 1.425V volt power supply, it can work fine.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 484 terminations.A 512KB flash can be seen on it.A2F500M3G can help you find system on chips with similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FG484M System On Chip (SoC) applications.

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F500M3G-FG484M

technical specifications, attributes, parameters and parts with similar specifications to A2F500M3G-FG484M.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Package / Case

    484-BGA

  • Surface Mount

    YES

  • Operating Temperature

    -55°C~125°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    484

  • ECCN Code

    3A001.A.2.C

  • HTS Code

    8542.39.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.5V

  • Terminal Pitch

    1mm

  • Frequency

    80MHz

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Base Part Number

    A2F500M3G

  • JESD-30 Code

    S-PBGA-B484

  • Supply Voltage-Max (Vsup)

    1.575V

  • Supply Voltage-Min (Vsup)

    1.425V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Number of I/O

    MCU - 41, FPGA - 128

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Organization

    11520 CLBS, 500000 GATES

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Primary Attributes

    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

  • Number of Equivalent Gates

    500000

  • Flash Size

    512KB

  • Height Seated (Max)

    2.44mm

  • Length

    23mm

  • Width

    23mm

  • RoHS Status

    Non-RoHS Compliant

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