Items : %s%s
SoC
Additional Feature
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- ALSO OPERATES AT 0.85V
- ALSO OPERATES AT 0.92-0.98 V SUPPLY
- ALSO OPERATES WITH 0.85 VOLT
- GPIO WITH FOUR 32-BIT BANKS
- IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
- IT ALSO OPERATES AT 0.95V NOMINAL VCC
- LG-MIN, WD-MIN
- LG-MIN,WD-MIN
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Contact Plating
- Copper, Silver, Tin
ECCN Code
- 3A001.A.2.C
- 3A991
- 3A991.D
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 2 Weeks
- 22 Weeks
- 25 Weeks
- 26 Weeks
- 3 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 99 Weeks
HTS Code
- 8542.31.00.01
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e3
Lifecycle Status
- IN PRODUCTION (Last Updated: 1 month ago)
- IN PRODUCTION (Last Updated: 2 days ago)
- IN PRODUCTION (Last Updated: 2 weeks ago)
- IN PRODUCTION (Last Updated: 3 days ago)
- IN PRODUCTION (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 3 weeks ago)
Max Operating Temperature
- 100°C
- 125°C
- 85°C
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- Not Applicable
Mount
- Surface Mount
Number of Pins
- 1152
- 1156
- 144
- 2
- 208
- 225
- 256
- 288
- 325
- 400
- 484
- 485
- 676
- 896
- 900
Number of Terminals
- 1517
Number of Terminations
- 1152
- 144
- 208
- 225
- 256
- 288
- 325
- 400
- 484
- 485
- 536
- 625
- 672
- 676
- 780
- 784
- 896
- 900
Operating Temperature
- -30°C~85°C
- -40°C~100°C TJ
- -40°C~125°C TJ
- -40°C~85°C
- -55°C~125°C TJ
- 0°C~100°C TJ
- 0°C~85°C TJ
Package / Case
- 100-LQFP
- 1152-BBGA, FCBGA
- 1156-BBGA, FCBGA
- 144-LQFP
- 1517-BBGA, FCBGA
- 1760-BBGA, FCBGA
- 1924-BBGA, FCBGA
- 208-BFQFP
- 225-LFBGA, CSPBGA
- 2397-BBGA, FCBGA
- 256-LBGA
- 256-LFBGA
- 288-TFBGA, CSPBGA
- 2912-BBGA, FCBGA
- 325-TFBGA, CSPBGA
- 400-LFBGA
- 400-LFBGA, CSPBGA
- 449-BGA
- 484-BBGA, FCBGA
- 484-BFBGA
- 484-BFBGA, FCBGA
- 484-BGA
- 484-FBGA
- 484-FBGA, FCBGA
- 484-LFBGA, CSPBGA
- 536-LFBGA, CSPBGA
- 625-BFBGA, FCBGA
- 64-LQFP
- 672-BBGA, FCBGA
- 672-FBGA
- 676-BBGA, FCBGA
- 676-BGA
- 780-BBGA, FCBGA
- 784-BFBGA, FCBGA
- 896-BBGA, FCBGA
- 896-BGA
- 900-BBGA, FCBGA
- BGA
- Module
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Discontinued
- Obsolete
Pbfree Code
- no
- yes
Peak Reflow Temperature (Cel)
- 225
- 235
- 245
- 250
- 260
- NOT SPECIFIED
Published
- 1997
- 2000
- 2001
- 2002
- 2003
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- Arria 10 SX
- Arria V ST
- Arria V SX
- Automotive, AEC-Q100, Cyclone® V SE
- Automotive, AEC-Q100, SmartFusion®2
- Automotive, AEC-Q100, Zynq®-7000 XA
- BCM7405
- Cyclone® V SE
- Cyclone® V ST
- Cyclone® V SX
- Sipeed MAIX-I
- SmartFusion®
- SmartFusion®2
- Stratix® 10 SX
- Zynq® UltraScale+™ MPSoC CG
- Zynq® UltraScale+™ MPSoC EG
- Zynq® UltraScale+™ MPSoC EV
- Zynq®-7000
Subcategory
- Field Programmable Gate Arrays
- Other Microprocessor ICs
- Other uPs/uCs/Peripheral ICs
Supplier Device Package
- 1152-FBGA, FC (35x35)
- 1152-FCBGA (35x35)
- 144-TQFP (20x20)
- 1517-FBGA, FC (40x40)
- 1517-FCBGA (40x40)
- 208-PQFP (28x28)
- 256-FPBGA (17x17)
- 288-CSP (11x11)
- 325-CSPBGA (11x11)
- 400-CSPBGA (17x17)
- 400-VFBGA (17x17)
- 484-CSPBGA (19x19)
- 484-FBGA (19x19)
- 484-FCBGA (19x19)
- 484-FPBGA (23x23)
- 485-CSBGA (19x19)
- 485-FCBGA (19x19)
- 672-UBGA (23x23)
- 676-FBGA (27x27)
- 676-FCBGA (27x27)
- 784-FCBGA (23x23)
- 896-FBGA (31x31)
- 900-FCBGA (31x31)
Surface Mount
- YES
Technology
- CMOS
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Pure Matte Tin (Sn)
- TIN LEAD
- TIN LEAD SILVER
- TIN LEAD/TIN LEAD SILVER
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead/Silver (Sn/Pb/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
- BALL
- GULL WING
Terminal Position
- BOTTOM
- QUAD
Weight
- 1.319103g
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Frequency | Width | Operating Temperature | Technology | Height Seated (Max) | HTS Code | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Number of Outputs | Propagation Delay | Turn On Delay Time | Supplier Device Package | Core Architecture | Speed | Number of Inputs | Memory Type | Core Processor | RAM Size | Number of I/O | Boundary Scan | Data Bus Width | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | Clock Frequency | RAM (words) | UV Erasable | Primary Attributes | Speed Grade | Programmable Logic Type | Number of Logic Cells | Number of Registers | Flash Size | Connectivity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "BCM3382ZIFEBG") |
BCM3382ZIFEBG | Broadcom | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
R8A77610DA01BGV#YE | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 449-BGA | 400MHz | SH-4A | 16KB | MPU | DDR | CANbus, I2C, SCI, SD, SSI, USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
10AS022C3U19E2LG | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | Arria 10 SX | Active | 3 (168 Hours) | 484 | 19mm | RoHS Compliant | 484-BFBGA | 19mm | 0°C~100°C TJ | CMOS | 3.25mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B484 | 0.87V | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 192 | 1.5GHz | 192 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 192 | MCU, FPGA | DMA, POR, WDT | FPGA - 220K Logic Elements | FIELD PROGRAMMABLE GATE ARRAY | 220000 | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||
 |
XC7Z035-1FFG900I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 1V | ROHS3 Compliant | 900 | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~100°C TJ | CMOS | 3.35mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | YES | 130 ps | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 1 | 343800 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||
|
XC7Z045-1FFG900CES | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 85°C | 0°C | RoHS Compliant | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | XC7Z045 | 900-FCBGA (31x31) | ARM | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | DMA | Kintex™-7 FPGA, 350K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
XC7Z045-L2FBG676I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 3 (168 Hours) | 676 | 3A991.D | 27mm | ROHS3 Compliant | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 27mm | -40°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 1mm | S-PBGA-B676 | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||
 |
XCZU2EG-L2SFVC784E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 784-BFBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B784 | 0.698V | 0.742V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||
|
XC7Z045-1FBG676I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z045 | YES | 1mm | S-PBGA-B676 | 1.05V | ARM | ROMless | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||
|
XCZU4CG-1SFVC784E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XCZU19EG-3FFVE1924E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 1924-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 668 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
10AS027E4F29E3SG | Altera | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2016 | 780 | 29mm | Non-RoHS Compliant | 29mm | CMOS | 3.35mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | OTHER | YES | 1mm | S-PBGA-B780 | 0.87V | 100°C | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 360 | 360 | FIELD PROGRAMMABLE GATE ARRAY | 270000 | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
1SX280HU3F50E2LG | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Stratix® 10 SX | Active | 3 (168 Hours) | 2397-BBGA, FCBGA | compliant | 0°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | FPGA - 2800K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XC7Z035-2FFG900I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 3A991.D | 31mm | ROHS3 Compliant | Copper, Silver, Tin | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 800MHz | 31mm | -40°C~100°C TJ | CMOS | 3.35mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | 1mm | S-PBGA-B900 | 100 ps | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | MCU, FPGA | DMA | Kintex™-7 FPGA, 275K Logic Cells | 2 | 343800 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||
 |
M2S010T-1VFG400 | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | RoHS Compliant | 400 | 400-LFBGA | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 0°C~85°C TJ | M2S010T | 400-VFBGA (17x17) | ARM | 166MHz | ARM® Cortex®-M3 | 64KB | 195 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 10K Logic Modules | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
XCZU3CG-1SFVA625E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 625-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 180 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XC7Z035-L2FFG676I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 27mm | ROHS3 Compliant | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 676-BBGA, FCBGA | 27mm | -40°C~100°C TJ | CMOS | 3.37mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 1mm | S-PBGA-B676 | 0.95V | 1.05V | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 800MHz | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||
 |
M2S010TS-FGG484I | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 484 | 23mm | RoHS Compliant | 484-BGA | 23mm | -40°C~100°C TJ | CMOS | 2.44mm | 8542.39.00.01 | e3 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 1mm | S-PBGA-B484 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 233 | 166MHz | 233 | ARM® Cortex®-M3 | 64KB | 233 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 10K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||||||||
 |
XA7Z020-1CLG400Q | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~125°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | NOT SPECIFIED | 0.8mm | Other uPs/uCs/Peripheral ICs | Not Qualified | 11.8V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | N | Artix™-7 FPGA, 85K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||
|
M2S050T-VFG400I | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | 2014 | SmartFusion®2 | Active | 3 (168 Hours) | 400 | 17mm | RoHS Compliant | 400-LFBGA | 17mm | -40°C~100°C TJ | CMOS | 1.51mm | 8542.39.00.01 | e3 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B400 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 207 | 166MHz | 207 | ARM® Cortex®-M3 | 64KB | 207 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 50K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||||
|
M2S050T-1FGG484 | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | RoHS Compliant | 484-BGA | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 0°C~85°C TJ | M2S050T | 484-FPBGA (23x23) | ARM | 166MHz | ARM® Cortex®-M3 | 64KB | 267 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 50K Logic Modules | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
1SX280HU2F50E2VGS3 | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Stratix® 10 SX | Active | 3 (168 Hours) | 2397-BBGA, FCBGA | 0°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | MCU, FPGA | DMA, WDT | FPGA - 2800K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M2S005-TQG144 | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 144 | 1.2V | 20mm | RoHS Compliant | 144 | 144-LQFP | 20mm | 0°C~85°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e3 | MATTE TIN | QUAD | GULL WING | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 0.5mm | Field Programmable Gate Arrays | Not Qualified | 1.26V | 84 | 166MHz | ARM® Cortex®-M3 | 64KB | 84 | MCU, FPGA | DDR | FPGA - 5K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 128KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||||||
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XCZU2EG-1SFVC784E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1SX250HN2F43E1VG | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Stratix® 10 SX | Active | 3 (168 Hours) | 1760-BBGA, FCBGA | compliant | 0°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | FPGA - 2500K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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XC7Z100-L2FFG900I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 3A991.D | 31mm | ROHS3 Compliant | Copper, Silver, Tin | 900 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 800MHz | 31mm | -40°C~100°C TJ | CMOS | 3.35mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | 1mm | 120 ps | 120 ps | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 444K Logic Cells | 554800 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||
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XCZU7CG-2FFVF1517I | Xilinx Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 1517-BBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | R-PBGA-B1517 | 0.825V | 0.876V | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 464 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||
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10AS048H3F34I2LG | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | Arria 10 SX | Active | 3 (168 Hours) | 35mm | RoHS Compliant | 1152-BBGA, FCBGA | 35mm | -40°C~100°C TJ | CMOS | 3.65mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | YES | 1mm | S-PBGA-B1152 | 0.87V | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 492 | 1.5GHz | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 492 | MCU, FPGA | DMA, POR, WDT | FPGA - 480K Logic Elements | FIELD PROGRAMMABLE GATE ARRAY | 480000 | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||
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5ASXMB5E4F31I5G | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Active | 3 (168 Hours) | RoHS Compliant | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1SX280HN1F43E1VG | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Stratix® 10 SX | Active | 3 (168 Hours) | 1760-BBGA, FCBGA | compliant | 0°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | FPGA - 2800K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M2S060TS-1FG484M | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | SmartFusion®2 | yes | Active | 3 (168 Hours) | 484 | 3A001.A.2.C | 23mm | RoHS Compliant | 484-BGA | not_compliant | 23mm | -55°C~125°C TJ | 2.44mm | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 1mm | S-PBGA-B484 | 1.14V | 1.26V | 166MHz | ARM® Cortex®-M3 | 64KB | 267 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 60K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
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10AS022C3U19E2LG Intel
484 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 192 I/O0.9V
Price: 0.0000
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XC7Z035-1FFG900I Xilinx
900 Terminations-40°C~100°C TJ 900 Pin System On ChipZynq?-7000 Series 130 I/O1V
Price: 0.0000
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XC7Z045-1FFG900CES Xilinx
0°C~85°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O
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XC7Z045-L2FBG676I Xilinx
676 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V
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XCZU2EG-L2SFVC784E Xilinx
784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O0.72V
Price: 0.0000
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XC7Z045-1FBG676I Xilinx
676 Terminations-40°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V
Price: 0.0000
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XCZU4CG-1SFVC784E Xilinx
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O
Price: 0.0000
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0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O
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XC7Z035-2FFG900I Xilinx
900 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
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M2S010T-1VFG400 Microsemi
0°C~85°C TJ 400 Pin M2S010T System On ChipSmartFusion?2 Series 195 I/O
Price: 0.0000
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XCZU3CG-1SFVA625E Xilinx
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O
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XC7Z035-L2FFG676I Xilinx
676 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V
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M2S010TS-FGG484I Microsemi
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V
Price: 0.0000
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XA7Z020-1CLG400Q Xilinx
400 Terminations-40°C~125°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O
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M2S050T-VFG400I Microsemi
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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M2S050T-1FGG484 Microsemi
0°C~85°C TJ M2S050T System On ChipSmartFusion?2 Series 267 I/O
Price: 0.0000
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M2S005-TQG144 Microsemi
144 Terminations0°C~85°C TJ 144 Pin System On ChipSmartFusion?2 Series 84 I/O1.2V
Price: 0.0000
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XCZU2EG-1SFVC784E Xilinx
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O
Price: 0.0000
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XC7Z100-L2FFG900I Xilinx
900 Terminations-40°C~100°C TJ 900 Pin System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
Price: 0.0000
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XCZU7CG-2FFVF1517I Xilinx Inc.
-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 464 I/O 0.85V
Price: 0.0000
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10AS048H3F34I2LG Intel
-40°C~100°C TJ System On Chip Arria 10 SX Series 492 I/O 0.9V
Price: 0.0000
RFQ -
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M2S060TS-1FG484M Microsemi
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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