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XCZU9CG-1FFVB1156I

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Manufacturer No:

XCZU9CG-1FFVB1156I

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU9CG-1FFVB1156I

Package:

1156-BBGA, FCBGA

Description:

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.Its package is 1156-BBGA, FCBGA.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC CG series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 328 I/Os.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU9CG-1FFVB1156I System On Chip (SoC) applications.

  • Wireless networking
  • PC peripherals
  • Smartphone accessories
  • ARM
  • ARM support modules
  • Special Issue Information
  • Smart appliances
  • ARM processors
  • Microcontroller
  • Multiprocessor system-on-chips (MPSoCs)
1. Purchase

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Tell us the model and quantity you need, our sales staff will reply the price in time.
EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU9CG-1FFVB1156I

technical specifications, attributes, parameters and parts with similar specifications to XCZU9CG-1FFVB1156I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Package / Case

    1156-BBGA, FCBGA

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2013

  • Series

    Zynq® UltraScale+™ MPSoC CG

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • HTS Code

    8542.31.00.01

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Number of I/O

    328

  • Speed

    500MHz, 1.2GHz

  • RAM Size

    256KB

  • Core Processor

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

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