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A2F060M3E-1FGG256I

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Manufacturer No:

A2F060M3E-1FGG256I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F060M3E-1FGG256I

Package:

256-LBGA

Description:

256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.With 16KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops together.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of MCU - 26, FPGA - 66 I/Os.Ideally, a power supply with a voltage of 1.5V should be used.In the SoCs wireless, high voltages above 1.575V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 1.425V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.system on a chip benefits from 256 terminations.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.There are 66 outputs available on this SoC.There is a flash of 128KB on it.You can get system on chips with similar specs and purposes by searching A2F060M3E.wireless SoCs operate at 100MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.256 pins are present on this computer SoC.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F060M3E-1FGG256I System On Chip (SoC) applications.

  • Measurement testers
  • Wireless sensor networks
  • Multiprocessor system-on-chips (MPSoCs)
  • Deep learning hardware
  • Keyboard
  • Networked sensors
  • Mobile market
  • Automated sorting equipment
  • Self-aware system-on-chip (SoC)
  • Networked sensors
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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Purchasing and Inquiry

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East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F060M3E-1FGG256I

technical specifications, attributes, parameters and parts with similar specifications to A2F060M3E-1FGG256I.

  • Type
    Parameter
    Select All
  • Package / Case

    256-LBGA

  • Surface Mount

    YES

  • Number of Pins

    256

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®

  • JESD-609 Code

    e1

  • Part Status

    Obsolete

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    256

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    250

  • Supply Voltage

    1.5V

  • Terminal Pitch

    1mm

  • Frequency

    100MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    A2F060M3E

  • Number of Outputs

    66

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.575V

  • Supply Voltage-Min (Vsup)

    1.425V

  • Interface

    EBI/EMI, I2C, SPI, UART, USART

  • Number of I/O

    MCU - 26, FPGA - 66

  • RAM Size

    16KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Organization

    1536 CLBS, 60000 GATES

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Number of Logic Blocks (LABs)

    8

  • Primary Attributes

    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

  • Number of Equivalent Gates

    60000

  • Flash Size

    128KB

  • Height Seated (Max)

    1.7mm

  • Length

    17mm

  • Width

    17mm

  • RoHS Status

    RoHS Compliant

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