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XCZU7CG-2FBVB900I

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Manufacturer No:

XCZU7CG-2FBVB900I

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU7CG-2FBVB900I

Package:

900-BBGA, FCBGA

Datasheet:

XCZU7CG-2FBVB900I

Description:

900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.85V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.In the Zynq? UltraScale+? MPSoC CG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells is important.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.204 I/Os are available in this SoC part.A power supply with a 0.85V rating is recommended.It is unsafe to operate the SoCs wireless at voltages above 0.876V.Power supplies of at least 0.825V are required.In total, there are 900 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU7CG-2FBVB900I System On Chip (SoC) applications.

  • Industrial automation devices
  • Functional safety for critical applications in the aerospace
  • Microcontroller based SoC ( RISC-V, ARM)
  • ARM processors
  • Healthcare
  • Print Special Issue Flyer
  • Deep learning hardware
  • Measurement testers
  • Digital Signal Processing
  • Networked sensors
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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FedEx International, 5-7 business days.
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Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU7CG-2FBVB900I

technical specifications, attributes, parameters and parts with similar specifications to XCZU7CG-2FBVB900I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Package / Case

    900-BBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2016

  • Series

    Zynq® UltraScale+™ MPSoC CG

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    900

  • HTS Code

    8542.31.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    0.85V

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    R-PBGA-B900

  • Supply Voltage-Max (Vsup)

    0.876V

  • Supply Voltage-Min (Vsup)

    0.825V

  • Number of I/O

    204

  • Speed

    533MHz, 1.3GHz

  • RAM Size

    256KB

  • uPs/uCs/Peripheral ICs Type

    MICROPROCESSOR CIRCUIT

  • Core Processor

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

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