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XC7Z035-2FFG676I

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Manufacturer No:

XC7Z035-2FFG676I

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z035-2FFG676I

Package:

676-BBGA, FCBGA

Datasheet:

XC7Z035-2FFG676I

Description:

676 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V

Quantity:

In Stock : 480

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Product Details

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This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In total, there are 676 terminations, which is great for system on a chip.In this wireless SoC, the frequency is set to 800MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.There is a maximum supply voltage of 1.05V.It is supplied with at least 950mV power.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z035-2FFG676I System On Chip (SoC) applications.

  • Industrial transport
  • Cyberphysical system-on-chip
  • ARM Cortex M4 microcontroller
  • Smartphones
  • Vending machines
  • Digital Media
  • Keyboard
  • Digital Signal Processing
  • Keywords
  • Mobile market
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z035-2FFG676I

technical specifications, attributes, parameters and parts with similar specifications to XC7Z035-2FFG676I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Mount

    Surface Mount

  • Package / Case

    676-BBGA, FCBGA

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2010

  • Series

    Zynq®-7000

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    676

  • ECCN Code

    3A991.D

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Additional Feature

    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1V

  • Terminal Pitch

    1mm

  • Frequency

    800MHz

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B676

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Max Supply Voltage

    1.05V

  • Min Supply Voltage

    950mV

  • Number of I/O

    130

  • RAM Size

    256KB

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Propagation Delay

    100 ps

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Core Architecture

    ARM

  • Boundary Scan

    YES

  • Speed Grade

    2

  • Primary Attributes

    Kintex™-7 FPGA, 275K Logic Cells

  • Number of Registers

    343800

  • Height Seated (Max)

    3.37mm

  • RoHS Status

    ROHS3 Compliant

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