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XC7Z015-2CLG485E

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Manufacturer No:

XC7Z015-2CLG485E

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z015-2CLG485E

Package:

484-LFBGA, CSPBGA

Datasheet:

XC7Z015-2CLG485E

Description:

485 Terminations0°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 484-LFBGA, CSPBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Artix?-7 FPGA, 74K Logic Cells.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.Power supply should be at least 0.95V.In total, there are 485 terminations, which is great for system on a chip.Just like other high-quality Other Microprocessor ICs will do, it is of outstanding system on a chip capability.A power supply of 11.8V is required.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.The wireless SoC works at a frequency of 766MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.In this computer SoC, there are 485 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z015-2CLG485E System On Chip (SoC) applications.

  • Optical drive
  • Smartphones
  • Medical Pressure
  • Video Imaging
  • Cyber security for critical applications in the aerospace
  • Defense
  • Sensor network-on-chip (sNoC)
  • Medical
  • Efficient hardware for training of neural networks
  • Keywords
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z015-2CLG485E

technical specifications, attributes, parameters and parts with similar specifications to XC7Z015-2CLG485E.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Mount

    Surface Mount

  • Package / Case

    484-LFBGA, CSPBGA

  • Number of Pins

    485

  • Operating Temperature

    0°C~100°C TJ

  • Packaging

    Tray

  • Published

    2010

  • Series

    Zynq®-7000

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    485

  • ECCN Code

    EAR99

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Additional Feature

    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

  • HTS Code

    8542.39.00.01

  • Subcategory

    Other Microprocessor ICs

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1V

  • Terminal Pitch

    0.8mm

  • Frequency

    766MHz

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.05V

  • Power Supplies

    11.8V

  • Supply Voltage-Min (Vsup)

    0.95V

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Number of I/O

    130

  • RAM Size

    256KB

  • uPs/uCs/Peripheral ICs Type

    MICROPROCESSOR CIRCUIT

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Data Bus Width

    32b

  • Core Architecture

    ARM

  • Boundary Scan

    YES

  • RAM (words)

    256000

  • Primary Attributes

    Artix™-7 FPGA, 74K Logic Cells

  • Bus Compatibility

    CAN; ETHERNET; I2C; SPI; UART; USB

  • UV Erasable

    N

  • Height Seated (Max)

    1.6mm

  • Length

    19mm

  • RoHS Status

    ROHS3 Compliant

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