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M2S150T-FC1152

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Manufacturer No:

M2S150T-FC1152

Manufacturer:

Microsemi

HK JDW NO:

523-M2S150T-FC1152

Package:

1152-BBGA, FCBGA

Datasheet:

M2S150T-FC1152

Description:

0°C~85°C TJ M2S150T System On ChipSmartFusion?2 Series 574 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 150K Logic Modules is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 574 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 574 outputs is available.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 574 inputs is available to the user.The logic system on chips contain 146124 logic cells.There is a flash of 512KB on it.By searching M2S150T, you can find system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.In this SoC meaning, ARM serves as the core architecture.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

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M2S150T-FC1152 System On Chip (SoC) applications.

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1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S150T-FC1152

technical specifications, attributes, parameters and parts with similar specifications to M2S150T-FC1152.

  • Type
    Parameter
    Select All
  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1mm

  • Reach Compliance Code

    not_compliant

  • Frequency

    166MHz

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Base Part Number

    M2S150T

  • JESD-30 Code

    S-PBGA-B1152

  • Number of Outputs

    574

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Interface

    CAN, Ethernet, I2C, SPI, UART, USART, USB

  • Number of I/O

    574

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    574

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Primary Attributes

    FPGA - 150K Logic Modules

  • Number of Logic Cells

    146124

  • Flash Size

    512KB

  • Height Seated (Max)

    2.9mm

  • Length

    35mm

  • Width

    35mm

  • RoHS Status

    Non-RoHS Compliant

  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 1 month ago)

  • Package / Case

    1152-BBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    SmartFusion®2

  • JESD-609 Code

    e0

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