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XCZU7CG-L1FBVB900I

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Manufacturer No:

XCZU7CG-L1FBVB900I

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU7CG-L1FBVB900I

Package:

900-BBGA, FCBGA

Description:

900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The system on a chip is part of the series Zynq? UltraScale+? MPSoC CG.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 204 I/Os.A power supply with a 0.72V rating is recommended.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.As long as it receives a power supply that is at least 0.698V, it should be able to function.system on a chip benefits from 900 terminations.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.Aside from that, this SoC processor is also equipped with some additional features that are present in ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU7CG-L1FBVB900I System On Chip (SoC) applications.

  • DC-input BLDC motor drive
  • Measurement tools
  • Test and Measurement
  • Efficient hardware for training of neural networks
  • Industrial robot
  • POS Terminals
  • Industrial automation devices
  • Mobile computing
  • Robotics
  • Networked Media Encode/Decode
1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU7CG-L1FBVB900I

technical specifications, attributes, parameters and parts with similar specifications to XCZU7CG-L1FBVB900I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Package / Case

    900-BBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2016

  • Series

    Zynq® UltraScale+™ MPSoC CG

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    900

  • Additional Feature

    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

  • HTS Code

    8542.31.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    0.72V

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    R-PBGA-B900

  • Supply Voltage-Max (Vsup)

    0.742V

  • Supply Voltage-Min (Vsup)

    0.698V

  • Number of I/O

    204

  • Speed

    500MHz, 1.2GHz

  • RAM Size

    256KB

  • uPs/uCs/Peripheral ICs Type

    MICROPROCESSOR CIRCUIT

  • Core Processor

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

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