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M2S025TS-1FCSG325

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Manufacturer No:

M2S025TS-1FCSG325

Manufacturer:

Microsemi

HK JDW NO:

523-M2S025TS-1FCSG325

Package:

325-TFBGA, CSPBGA

Datasheet:

M2S025TS-1FCSG325

Description:

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 25K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.An integral part of this SoC consists of a total of 180 I/Os.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.In order to run it, it must be fed by at least 1.14V of power.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 325 terminations, so system on a chip is really aided by this.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 180 outputs is available.System on chip requires 1.2V power supplies.There are 180 inputs available on the SoC chip.A logic SoC has 27696 logic cells.The flash size of the SoC meaning is 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025TS-1FCSG325 System On Chip (SoC) applications.

  • Industrial sectors
  • Automated sorting equipment
  • Fitness
  • Transmitters
  • AC-input BLDC motor drive
  • PC peripherals
  • Communication interfaces ( I2C, SPI )
  • Microprocessors
  • Temperature
  • CNC control
1. Purchase

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Tell us the model and quantity you need, our sales staff will reply the price in time.
EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S025TS-1FCSG325

technical specifications, attributes, parameters and parts with similar specifications to M2S025TS-1FCSG325.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 2 weeks ago)

  • Package / Case

    325-TFBGA, CSPBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®2

  • JESD-609 Code

    e3

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    325

  • Terminal Finish

    MATTE TIN

  • Additional Feature

    LG-MIN, WD-MIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    0.5mm

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B325

  • Number of Outputs

    180

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    180

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    180

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 25K Logic Modules

  • Number of Logic Cells

    27696

  • Flash Size

    256KB

  • Height Seated (Max)

    1.01mm

  • Length

    11mm

  • Width

    11mm

  • RoHS Status

    RoHS Compliant

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