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M2S025-FCS325I

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Manufacturer No:

M2S025-FCS325I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S025-FCS325I

Package:

325-TFBGA, CSPBGA

Datasheet:

M2S025-FCS325I

Description:

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Its package is 325-TFBGA, CSPBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 25K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.Total I/Os on this SoC part are 180.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.In order to run it, it must be fed by at least 1.14V of power.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.The system on a chip uses 325 terminations in total.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.The SoC chip that comes with this module can be configured to have 180 outputs.System on chip requires 1.2V power supplies.The SoC chip is equipped with 180 inputs.A logic SoC has 27696 logic cells.This flash has a size of 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025-FCS325I System On Chip (SoC) applications.

  • Sports
  • Central inverter
  • Special Issue Editors
  • Smart appliances
  • Optical drive
  • AC drive control module
  • Wireless sensor networks
  • RISC-V
  • Industrial robot
  • Flow Sensors
1. Purchase

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Tell us the model and quantity you need, our sales staff will reply the price in time.
EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S025-FCS325I

technical specifications, attributes, parameters and parts with similar specifications to M2S025-FCS325I.

  • Type
    Parameter
    Select All
  • Series

    SmartFusion®2

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    325

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Additional Feature

    LG-MIN, WD-MIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    0.5mm

  • Reach Compliance Code

    not_compliant

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B325

  • Number of Outputs

    180

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    180

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    180

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 25K Logic Modules

  • Number of Logic Cells

    27696

  • Flash Size

    256KB

  • Height Seated (Max)

    1.01mm

  • Length

    11mm

  • Width

    11mm

  • RoHS Status

    Non-RoHS Compliant

  • Factory Lead Time

    8 Weeks

  • Package / Case

    325-TFBGA, CSPBGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

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