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BGM1033N7E6327XUSA1
BGM1033N7E6327XUSA1
376-BGM1033N7E6327XUSA1
6-WDFN Exposed Pad
BGM1033N7E6327XUSA1 datasheet pdf and RF Misc ICs and Modules product details from Infineon Technologies stock available at HK JDW
In Stock : 999
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Product Details
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BGM1033N7E6327XUSA1 Overview
As a result, RF modulator operates on the basis of frequency 1575.42MHz.RF ICs with enhanced 6-WDFN Exposed Pad packages are excellent with common characteristics.The Tape & Reel (TR) package contains this RF modulator.A Surface Mount-type PCB or development board can be used to place this RF modulator.In order to drive and receive signals from data, this RF module has 6 terminations integrated.7-pin RF module with improved power dissipation control.There must be a RF switch IC's temperature below 85°C during operation.This RF switch IC should not operate at a temperature lower than -40°C.
BGM1033N7E6327XUSA1 Features
Frequency of 1575.42MHz
6-WDFN Exposed Pad package
Tape & Reel (TR)
6 terminations
7 pins
BGM1033N7E6327XUSA1 Applications
There are a lot of Infineon Technologies BGM1033N7E6327XUSA1 RF Misc ICs and Modules applications.
- PA linearization
- Self-parking
- Broadband/CATV
- Fixed wireless access
- Communications test equipmen
- Wireless LAN
- PLL frequency range extender
- Phase shifter
- Amplitude modulation
- Demodulation
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