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BGM1032N7E6327XUSA1
BGM1032N7E6327XUSA1
376-BGM1032N7E6327XUSA1
6-WDFN Exposed Pad
BGM1032N7E6327XUSA1 datasheet pdf and RF Misc ICs and Modules product details from Infineon Technologies stock available at HK JDW
In Stock : 999
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Product Details
Purchasing and Inquiry
BGM1032N7E6327XUSA1 Overview
Using the frequency of 1575.42MHz, RF modulator operates.RF IC benefit from this IC's enhanced 6-WDFN Exposed Pad package.In the Tape & Reel (TR) package, this RF modulator is mounted.This RF modulator can be placed on any Surface Mount-type PCB or development board.Integrated into this RF module are 6 terminations that are used for driving and receiving signals from data.The RF module has improved power dissipation control.Below 85°C is the required RF switch IC's operating temperature.It operates with the RF switch IC's minimal operating temperature of -40°C to ensure its reliability.
BGM1032N7E6327XUSA1 Features
Frequency of 1575.42MHz
6-WDFN Exposed Pad package
Tape & Reel (TR)
6 terminations
7 pins
BGM1032N7E6327XUSA1 Applications
There are a lot of Infineon Technologies BGM1032N7E6327XUSA1 RF Misc ICs and Modules applications.
- PA predistortion
- Test and Measurement
- Cellular base stations
- Broadband/CATV
- Phase sensitive detection
- Lock in amplification
- Cellular Infrastructure
- Variable matched attenuator
- Amplitude modulation
- Electronic bumper
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