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A2F500M3G-1FGG484I

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Manufacturer No:

A2F500M3G-1FGG484I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F500M3G-1FGG484I

Package:

484-BGA

Description:

484 Terminations-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V Min 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 484-BGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 128 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 484 terminations in total and that really benefits system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 128 outputs.You will need to provide 1.51.82.53.3V power supplies in order to run system on chip.It has a 512KB flash.A search for A2F500M3G will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.This power supply is rated with a maximum voltage of 1.575V.A minimum of 1.425V are supplied to it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FGG484I System On Chip (SoC) applications.

  • Functional safety for critical applications in the automotive
  • Functional safety for critical applications in the industrial sectors
  • Apple smart watch
  • ARM processors
  • DC-input BLDC motor drive
  • Personal Computers
  • PC peripherals
  • ARM support modules
  • POS Terminals
  • Digital Signal Processing
1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F500M3G-1FGG484I

technical specifications, attributes, parameters and parts with similar specifications to A2F500M3G-1FGG484I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Mount

    Surface Mount

  • Package / Case

    484-BGA

  • Number of Pins

    484

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    484

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    250

  • Supply Voltage

    1.5V

  • Terminal Pitch

    1mm

  • Frequency

    100MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    A2F500M3G

  • Number of Outputs

    128

  • Qualification Status

    Not Qualified

  • Operating Supply Voltage

    1.5V

  • Power Supplies

    1.51.82.53.3V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Memory Size

    13.5kB

  • Operating Supply Current

    16.5mA

  • Number of I/O

    MCU - 41, FPGA - 128

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Data Rate

    400 kbps

  • Architecture

    MCU, FPGA

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Number of Logic Elements/Cells

    5500

  • Core Architecture

    ARM

  • Number of Gates

    500000

  • Primary Attributes

    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

  • Flash Size

    512KB

  • Height Seated (Max)

    2.44mm

  • Length

    23mm

  • Width

    23mm

  • RoHS Status

    RoHS Compliant

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