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A2F500M3G-1FGG484

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Manufacturer No:

A2F500M3G-1FGG484

Manufacturer:

Microsemi

HK JDW NO:

523-A2F500M3G-1FGG484

Package:

484-BGA

Datasheet:

A2F500M3G-1FGG484

Description:

0°C~85°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/OMin 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.One important thing to mark down is that this SoC meaning combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.MCU - 41, FPGA - 128 I/Os in total are included in this SoC part.This flash has a size of 512KB.You can get system on chips with similar specs and purposes by searching A2F500M3G.100MHz is the wireless SoC's frequency.In terms of core architecture, the SoC meaning relies on ARM.This is the version with 484 pins.It just takes 0°C for the SoC computing to start up, and that is all it needs.This SoC system on chip operates at a maximum design temperature of 85°C.The maximum supply voltage is rated as 1.575V.It is supplied with at least 1.425V power.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FGG484 System On Chip (SoC) applications.

  • Temperature
  • Industrial transport
  • Samsung galaxy gear
  • Networked sensors
  • ARM support modules
  • Apple smart watch
  • Remote control
  • Functional safety for critical applications in the aerospace
  • Medical
  • Sensor network-on-chip (sNoC)
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
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Shipping

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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F500M3G-1FGG484

technical specifications, attributes, parameters and parts with similar specifications to A2F500M3G-1FGG484.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Mount

    Surface Mount

  • Package / Case

    484-BGA

  • Number of Pins

    484

  • Supplier Device Package

    484-FPBGA (23x23)

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2011

  • Series

    SmartFusion®

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    85°C

  • Min Operating Temperature

    0°C

  • Frequency

    100MHz

  • Base Part Number

    A2F500M3G

  • Operating Supply Voltage

    1.5V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Memory Size

    13.5kB

  • Operating Supply Current

    16.5mA

  • Number of I/O

    MCU - 41, FPGA - 128

  • Speed

    100MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Data Rate

    400 kbps

  • Architecture

    MCU, FPGA

  • Number of Logic Elements/Cells

    5500

  • Core Architecture

    ARM

  • Number of Gates

    500000

  • Max Frequency

    120MHz

  • Speed Grade

    1

  • Primary Attributes

    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

  • Number of Registers

    11520

  • Flash Size

    512KB

  • Radiation Hardening

    No

  • RoHS Status

    RoHS Compliant

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