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XCZU2CG-L2SFVA625E

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Manufacturer No:

XCZU2CG-L2SFVA625E

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU2CG-L2SFVA625E

Package:

625-BFBGA, FCBGA

Description:

625 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.72V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is embedded in this SoC.It has been assigned a package 625-BFBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part has a total of 180 I/Os.It is recommended to use a 0.72V power supply.In the SoCs wireless, voltages above 0.742V are considered unsafe.Power supply should be at least 0.698V.A system on a chip benefits from having 625 terminations.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.This SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU2CG-L2SFVA625E System On Chip (SoC) applications.

  • sequence controllers
  • Central alarm system
  • AC drive control module
  • Efficient hardware for inference of neural networks
  • Industrial automation devices
  • Keywords
  • Temperature
  • Microprocessors
  • Networked sensors
  • Efficient hardware for training of neural networks
1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU2CG-L2SFVA625E

technical specifications, attributes, parameters and parts with similar specifications to XCZU2CG-L2SFVA625E.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Package / Case

    625-BFBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~100°C TJ

  • Packaging

    Tray

  • Published

    2016

  • Series

    Zynq® UltraScale+™ MPSoC CG

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    625

  • Additional Feature

    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

  • HTS Code

    8542.31.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    0.72V

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    R-PBGA-B625

  • Supply Voltage-Max (Vsup)

    0.742V

  • Supply Voltage-Min (Vsup)

    0.698V

  • Number of I/O

    180

  • Speed

    533MHz, 1.3GHz

  • RAM Size

    256KB

  • uPs/uCs/Peripheral ICs Type

    MICROPROCESSOR CIRCUIT

  • Core Processor

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

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