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A2F500M3G-1FGG256

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Manufacturer No:

A2F500M3G-1FGG256

Manufacturer:

Microsemi

HK JDW NO:

523-A2F500M3G-1FGG256

Package:

256-LBGA

Datasheet:

A2F500M3G-1FGG256

Description:

0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.In the SmartFusion? series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.There is one thing to note about this SoC security: it combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 25, FPGA - 66 I/Os are available in this SoC part.There is a flash of 512KB.By searching A2F500M3G, you will find system on chips with similar specs and purposes.wireless SoCs operate at 100MHz.In this SoC meaning, ARM serves as the core architecture.Currently, the computer SoC is available in a 256-pin version.0°C is just enough for the SoC computing to start up.There is a maximum operating temperature of 85°C set for this SoC system on chip during its design.This power supply is rated with a maximum voltage of 1.575V.The SoC security is powered at least by 1.425V.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FGG256 System On Chip (SoC) applications.

  • Embedded systems
  • Sports
  • Industrial robot
  • Functional safety for critical applications in the automotive
  • Deep learning hardware
  • Transmitters
  • ARM
  • Self-aware system-on-chip (SoC)
  • Industrial sectors
  • Wireless networking
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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3. RFQ (Request for Quotations)

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4. Shipping Cost

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F500M3G-1FGG256

technical specifications, attributes, parameters and parts with similar specifications to A2F500M3G-1FGG256.

  • Type
    Parameter
    Select All
  • Mount

    Surface Mount

  • Package / Case

    256-LBGA

  • Number of Pins

    256

  • Supplier Device Package

    256-FPBGA (17x17)

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    85°C

  • Min Operating Temperature

    0°C

  • Frequency

    100MHz

  • Base Part Number

    A2F500M3G

  • Operating Supply Voltage

    1.5V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Memory Size

    13.5kB

  • Operating Supply Current

    16.5mA

  • Number of I/O

    MCU - 25, FPGA - 66

  • Speed

    100MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Data Rate

    400 kbps

  • Architecture

    MCU, FPGA

  • Number of Logic Elements/Cells

    5500

  • Core Architecture

    ARM

  • Number of Gates

    500000

  • Max Frequency

    120MHz

  • Primary Attributes

    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

  • Flash Size

    512KB

  • Radiation Hardening

    No

  • RoHS Status

    RoHS Compliant

  • Lead Free

    Lead Free

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