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A2F500M3G-1FG484I

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Manufacturer No:

A2F500M3G-1FG484I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F500M3G-1FG484I

Package:

484-BGA

Datasheet:

A2F500M3G-1FG484I

Description:

484 Terminations-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V Min 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the SmartFusion? series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 41, FPGA - 128 inputs and outputs.It is recommended to use a 1.5V power supply.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Having 484 terminations in total makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.This SoC chip is capable of having 128 outputs, which is convenient.There is a flash of 512KB.Search A2F500M3G for system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.In this SoC meaning, ARM serves as the core architecture.The computer SoC has a pin count of 484.It is rated with 1.575V maximum supply voltage.Power is provided to it at least to the extent that 1.425V is required.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FG484I System On Chip (SoC) applications.

  • Defense
  • Industrial automation devices
  • Deep learning hardware
  • PC peripherals
  • Smartphones
  • Functional safety for critical applications in the industrial sectors
  • Communication interfaces ( I2C, SPI )
  • External USB hard disk/SSD
  • Avionics
  • Microcontroller based SoC ( RISC-V, ARM)
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
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Step5Bar-code shipping tag

A2F500M3G-1FG484I

technical specifications, attributes, parameters and parts with similar specifications to A2F500M3G-1FG484I.

  • Type
    Parameter
    Select All
  • Time@Peak Reflow Temperature-Max (s)

    20

  • Base Part Number

    A2F500M3G

  • Number of Outputs

    128

  • Operating Supply Voltage

    1.5V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Operating Supply Current

    1mA

  • Number of I/O

    MCU - 41, FPGA - 128

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Number of Gates

    500000

  • Number of Logic Blocks (LABs)

    24

  • Speed Grade

    1

  • Primary Attributes

    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

  • Number of Registers

    11520

  • Flash Size

    512KB

  • Height Seated (Max)

    2.44mm

  • Length

    23mm

  • Width

    23mm

  • Radiation Hardening

    No

  • RoHS Status

    Non-RoHS Compliant

  • Lead Free

    Contains Lead

  • Factory Lead Time

    12 Weeks

  • Mount

    Surface Mount

  • Package / Case

    484-BGA

  • Number of Pins

    484

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    484

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    225

  • Supply Voltage

    1.5V

  • Frequency

    100MHz

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