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A2F200M3F-PQ208I

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Manufacturer No:

A2F200M3F-PQ208I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F200M3F-PQ208I

Package:

208-BFQFP

Datasheet:

A2F200M3F-PQ208I

Description:

208 Terminations-40°C~100°C TJ 208 Pin A2F200 System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Manufacturer assigns package 208-BFQFP to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion? series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.There is a state-of-the-art Tray package that houses this SoC system on a chip.In total, this SoC part has MCU - 22, FPGA - 66 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.For the SoCs wireless, a voltage higher than 1.575V is considered unsafe.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 208 terminations, which is great for system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 66 outputs.There is a flash of 256KB on it.Searching A2F200 will yield system on chips with similar specs and purposes.The wireless SoC works at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.This is the version with 208 pins.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-PQ208I System On Chip (SoC) applications.

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  • Sports
  • ARM
  • Measurement tools
  • Samsung galaxy gear
  • Embedded systems
  • Central alarm system
  • Functional safety for critical applications in the aerospace
  • String inverter
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F200M3F-PQ208I

technical specifications, attributes, parameters and parts with similar specifications to A2F200M3F-PQ208I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Package / Case

    208-BFQFP

  • Surface Mount

    YES

  • Number of Pins

    208

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®

  • JESD-609 Code

    e0

  • Part Status

    Obsolete

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    208

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    QUAD

  • Terminal Form

    GULL WING

  • Peak Reflow Temperature (Cel)

    225

  • Supply Voltage

    1.5V

  • Terminal Pitch

    0.5mm

  • Frequency

    80MHz

  • Time@Peak Reflow Temperature-Max (s)

    20

  • Base Part Number

    A2F200

  • Number of Outputs

    66

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.575V

  • Supply Voltage-Min (Vsup)

    1.425V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Number of I/O

    MCU - 22, FPGA - 66

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Number of Logic Blocks (LABs)

    8

  • Primary Attributes

    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

  • Number of Equivalent Gates

    200000

  • Flash Size

    256KB

  • Height Seated (Max)

    4.1mm

  • RoHS Status

    Non-RoHS Compliant

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