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  • A2F200M3F-FG256

A2F200M3F-FG256

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Manufacturer No:

A2F200M3F-FG256

Manufacturer:

Microsemi

HK JDW NO:

523-A2F200M3F-FG256

Package:

256-LBGA

Datasheet:

A2F200M3F-FG256

Description:

256 Terminations0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Package 256-LBGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion? series contains this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.It is really beneficial to have system on a chip since there are 256 terminations in total.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There are 66 outputs available on this SoC.This flash has a size of 256KB.You can get system on chips with similar specs and purposes by searching A2F200.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is available in 256-pin form.A maximum supply voltage of 1.575V is specified for the SoC security.A minimum of 1.425V are supplied to it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-FG256 System On Chip (SoC) applications.

  • Flow Sensors
  • Medical Pressure
  • Cyber security for critical applications in the aerospace
  • High-end PLC
  • Transmitters
  • Video Imaging
  • Digital Signal Processing
  • External USB hard disk/SSD
  • Cyberphysical system-on-chip
  • Smartphones
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F200M3F-FG256

technical specifications, attributes, parameters and parts with similar specifications to A2F200M3F-FG256.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Mount

    Surface Mount

  • Package / Case

    256-LBGA

  • Number of Pins

    256

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2012

  • Series

    SmartFusion®

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    256

  • Terminal Finish

    TIN LEAD/TIN LEAD SILVER

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    225

  • Supply Voltage

    1.5V

  • Terminal Pitch

    1mm

  • Frequency

    80MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    A2F200

  • Number of Outputs

    66

  • Qualification Status

    Not Qualified

  • Operating Supply Voltage

    1.5V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Operating Supply Current

    2mA

  • Number of I/O

    MCU - 25, FPGA - 66

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Number of Gates

    200000

  • Number of Logic Blocks (LABs)

    8

  • Primary Attributes

    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

  • Flash Size

    256KB

  • Height Seated (Max)

    1.7mm

  • Length

    17mm

  • Width

    17mm

  • RoHS Status

    Non-RoHS Compliant

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