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A2F200M3F-1FG484I

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Manufacturer No:

A2F200M3F-1FG484I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F200M3F-1FG484I

Package:

484-BGA

Datasheet:

A2F200M3F-1FG484I

Description:

484 Terminations-40°C~100°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 484-BGA package.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The SmartFusion? series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.It comes in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 94 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.The SoCs wireless is considered unreliable if the voltage exceeds 1.575V.Power supply should be at least 1.425V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.A system on a chip benefits from having 484 terminations.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.The SoC chip that comes with this module can be configured to have 94 outputs.It has a 256KB flash.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.The wireless SoC works at a frequency of 100MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Currently, the computer SoC is available in a 484-pin version.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1FG484I System On Chip (SoC) applications.

  • Flow Sensors
  • Medical
  • Remote control
  • Microprocessors
  • Microcontroller based SoC ( RISC-V, ARM)
  • Microcontroller
  • Three phase UPS
  • Temperature
  • Vending machines
  • Industrial sectors
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F200M3F-1FG484I

technical specifications, attributes, parameters and parts with similar specifications to A2F200M3F-1FG484I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Package / Case

    484-BGA

  • Surface Mount

    YES

  • Number of Pins

    484

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    SmartFusion®

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    484

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    225

  • Supply Voltage

    1.5V

  • Terminal Pitch

    1mm

  • Frequency

    100MHz

  • Time@Peak Reflow Temperature-Max (s)

    20

  • Base Part Number

    A2F200

  • Number of Outputs

    94

  • Supply Voltage-Max (Vsup)

    1.575V

  • Supply Voltage-Min (Vsup)

    1.425V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Operating Supply Current

    1mA

  • Number of I/O

    MCU - 41, FPGA - 94

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Number of Gates

    200000

  • Number of Logic Blocks (LABs)

    8

  • Primary Attributes

    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

  • Flash Size

    256KB

  • Height Seated (Max)

    2.44mm

  • Length

    23mm

  • Width

    23mm

  • Radiation Hardening

    No

  • RoHS Status

    Non-RoHS Compliant

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