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A2F200M3F-1FG256I

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Manufacturer No:

A2F200M3F-1FG256I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F200M3F-1FG256I

Package:

256-LBGA

Datasheet:

A2F200M3F-1FG256I

Description:

256 Terminations-40°C~100°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion? is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.Total I/Os on this SoC part are MCU - 25, FPGA - 66.A 1.5V power supply should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.In order to run it, it must be fed by at least 1.425V of power.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 256 terminations, which is great for system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 66 outputs, which is convenient.It has a 256KB flash.A2F200 can help you find system on chips with similar specs and purposes.A frequency of 100MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.The computer SoC is the 256-pin version.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1FG256I System On Chip (SoC) applications.

  • Robotics
  • Measurement tools
  • AC-input BLDC motor drive
  • Transmitters
  • Vending machines
  • Special Issue Information
  • Industrial Pressure
  • Microcontroller
  • ARM Cortex M4 microcontroller
  • Mobile market
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

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Payment Method

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F200M3F-1FG256I

technical specifications, attributes, parameters and parts with similar specifications to A2F200M3F-1FG256I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Package / Case

    256-LBGA

  • Surface Mount

    YES

  • Number of Pins

    256

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    SmartFusion®

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    256

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    225

  • Supply Voltage

    1.5V

  • Terminal Pitch

    1mm

  • Frequency

    100MHz

  • Time@Peak Reflow Temperature-Max (s)

    20

  • Base Part Number

    A2F200

  • Number of Outputs

    66

  • Supply Voltage-Max (Vsup)

    1.575V

  • Supply Voltage-Min (Vsup)

    1.425V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Operating Supply Current

    3mA

  • Number of I/O

    MCU - 25, FPGA - 66

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Number of Gates

    200000

  • Number of Logic Blocks (LABs)

    8

  • Primary Attributes

    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

  • Flash Size

    256KB

  • Height Seated (Max)

    1.7mm

  • Length

    17mm

  • Width

    17mm

  • Radiation Hardening

    No

  • RoHS Status

    Non-RoHS Compliant

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