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A2F200M3F-1CSG288

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Manufacturer No:

A2F200M3F-1CSG288

Manufacturer:

Microsemi

HK JDW NO:

523-A2F200M3F-1CSG288

Package:

288-TFBGA, CSPBGA

Datasheet:

A2F200M3F-1CSG288

Description:

0°C~85°C TJ 288 Pin A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/OMin 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.The manufacturer assigns this system on a chip with a 288-TFBGA, CSPBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.In the SmartFusion? series, this system on chip SoC is included.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 31, FPGA - 78 I/Os.This flash has a size of 256KB.Search A2F200 for system on chips with similar specs and purposes.wireless SoCs operate at 100MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.This is the version with 288 pins.In order for the SoC computing to start up, 0°C is sufficient.There is a maximum operating temperature of 85°C set for this SoC system on chip during its design.A maximum supply voltage of 1.575V is specified for the SoC security.A minimum of 1.425V power is supplied to it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1CSG288 System On Chip (SoC) applications.

  • Smartphones
  • CNC control
  • Industrial sectors
  • Avionics
  • Industrial Pressure
  • Industrial automation devices
  • Medical Pressure
  • Smart appliances
  • ARM processors
  • sequence controllers
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Purchasing and Inquiry

Payment Method

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East West Bank charge US$30.00 banking fee.
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From $40.00 basic shipping fee depend on zone and country.
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From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F200M3F-1CSG288

technical specifications, attributes, parameters and parts with similar specifications to A2F200M3F-1CSG288.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Mount

    Surface Mount

  • Package / Case

    288-TFBGA, CSPBGA

  • Number of Pins

    288

  • Supplier Device Package

    288-CSP (11x11)

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2013

  • Series

    SmartFusion®

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    85°C

  • Min Operating Temperature

    0°C

  • Frequency

    100MHz

  • Base Part Number

    A2F200

  • Operating Supply Voltage

    1.5V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Number of I/O

    MCU - 31, FPGA - 78

  • Speed

    100MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Core Architecture

    ARM

  • Primary Attributes

    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

  • Flash Size

    256KB

  • RoHS Status

    RoHS Compliant

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