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A2F060M3E-TQ144

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Manufacturer No:

A2F060M3E-TQ144

Manufacturer:

Microsemi

HK JDW NO:

523-A2F060M3E-TQ144

Package:

144-LQFP

Datasheet:

A2F060M3E-TQ144

Description:

144 Terminations0°C~85°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/O1.5V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 144-LQFP.With 16KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part contains a total of MCU - 21, FPGA - 33 I/Os in total.Ideally, a power supply with a voltage of 1.5V should be used.There are voltages higher than 1.575V that should be avoided when using the SoCs wireless.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.system on a chip benefits from 144 terminations.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.It is possible to use this SoC chip with 33 outputs.A power supply of 1.51.82.53.3V is required to run system on chip.A SoC chip with 33 inputs is available.The flash is set to 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F060M3E-TQ144 System On Chip (SoC) applications.

  • Mobile market
  • Keywords
  • Industrial automation devices
  • Flow Sensors
  • Personal Computers
  • Efficient hardware for training of neural networks
  • Temperature Sensors
  • USB hard disk enclosure
  • Medical
  • Mouse
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F060M3E-TQ144

technical specifications, attributes, parameters and parts with similar specifications to A2F060M3E-TQ144.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    2 Weeks

  • Package / Case

    144-LQFP

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®

  • JESD-609 Code

    e0

  • Part Status

    Obsolete

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    144

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    QUAD

  • Terminal Form

    GULL WING

  • Peak Reflow Temperature (Cel)

    225

  • Supply Voltage

    1.5V

  • Terminal Pitch

    0.5mm

  • Frequency

    80MHz

  • Time@Peak Reflow Temperature-Max (s)

    20

  • Base Part Number

    A2F060M3E

  • JESD-30 Code

    S-PQFP-G144

  • Number of Outputs

    33

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.575V

  • Power Supplies

    1.51.82.53.3V

  • Supply Voltage-Min (Vsup)

    1.425V

  • Interface

    EBI/EMI, I2C, SPI, UART, USART

  • Number of I/O

    MCU - 21, FPGA - 33

  • RAM Size

    16KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Number of Inputs

    33

  • Organization

    1536 CLBS, 60000 GATES

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Primary Attributes

    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

  • Number of Equivalent Gates

    60000

  • Flash Size

    128KB

  • Height Seated (Max)

    1.6mm

  • Length

    20mm

  • Width

    20mm

  • RoHS Status

    Non-RoHS Compliant

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