
Items : %s%s
IC Adapters
Additional Feature
- ADAPTER
- SOCKET ADAPTER
- SOCKET ADAPTER, 94V-0
- SOCKET ADAPTER, UL 94V-0
- STANDARD: UL 94V-0
- UL 94V-0
Board Material
- FR4 Epoxy Glass
- Polyimide (PI)
Body Breadth
- 0.7 inch
Body Depth
- 0.3 inch
Body Material
- Glass, Polysulfone
Cable Length
- 3m
Connector Type
- DIP, Socket
Contact Finish - Mating
- GOLD
- GOLD (10)
- GOLD (10) OVER NICKEL (100)
- NOT SPECIFIED
- Silver
- TIN
- TIN LEAD
- Tin-Lead
Contact Finish - Post
- Gold
- Tin
- Tin-Lead
Contact Finish Thickness - Post
- Flash
Contact Material
- Brass
- Copper
Contact Material - Mating
- Beryllium Copper
- Brass
- Copper
- Phosphor Bronze
Contact Material - Post
- Beryllium Copper
- Brass
- Brass Alloy
- Phosphor Bronze
Contact Plating
- Gold
- Gold, Tin
- Lead, Tin
- Silver
- Tin
Contact Style
- RND PIN-SKT
Convert From (Adapter End)
- AT90PWM1
- AT90PWM2
- DIP, 0.3 (7.62mm) Row Spacing
- DIP, 0.4 (10.16mm) Row Spacing
- DIP, 0.6 (15.24mm) Row Spacing
- DIP, 0.8 (20.32mm) Row Spacing
- DIP, 0.9 (22.86mm) Row Spacing
- DIP, 1.0 (25.40mm) Row Spacing
- HB2E Relay
- MSOP
- Multiple Packages
- PLCC
- PQFP
- QFP
- SIP
- Socket, 0.6 (15.24mm) Row Spacing
- SOIC
- SOIC-W
- SOJ
- SSOP
- TQFP
- TSOP
- VQFP
Convert To (Adapter End)
- DIP
- DIP, 0.3 (7.62mm) Row Spacing
- DIP, 0.4 (10.16mm) Row Spacing
- DIP, 0.6 (15.24mm) Row Spacing
- DIP, 0.8 (20.32mm) Row Spacing
- DIP, 0.9 (22.86mm) Row Spacing
- DIP, 1.0 (25.40mm) Row Spacing
- JEDEC
- PGA
- PLCC
- QFP
- SOIC
- SOWIC
Core Architecture
- AVR
Current Rating
- 1A
- 3A
Current Rating (Amps)
- 1A
- 3A
Depth
- 25.4mm
- 32.3mm
- 32mm
- 43.2mm
- 6.9mm
Device Socket Type
- IC SOCKET
ECCN Code
- EAR99
Factory Lead Time
- 16 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
Feature
- Closed Frame
- High Temperature
- Socket Included
Flammability Rating
- UL94 V-0
Gender
- Female
Height
- 1.58mm
- 2.29mm
- 2.39mm
- 5.85mm
- 6.08mm
- 6.9mm
Housing Material
- Polyamide
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Polyester
- Polyphenylene Sulfide (PPS)
- Polysulfone (PSU), Glass Filled
- RYTON
Insulation Resistance
- 1GOhm
JESD-609 Code
- e0
- e3
- e4
Lead Free
- Contains Lead
- Lead Free
Lead Length
- 2.032mm
- 2.286mm
- 3.175mm
- 3.302mm
- 3.683mm
- 3.81mm
- 3m
- 5.9944mm
Lead Pitch
- 1.27mm
- 2.54mm
Length
- 10.2mm
- 100.3mm
- 17.8mm
- 19.4mm
- 20.3mm
- 22.2mm
- 22.9mm
- 25.4mm
- 30.5mm
- 34.3mm
- 35.6mm
- 39.4mm
- 3m
- 40.1mm
- 40.5mm
- 40.6mm
- 43.2mm
- 45mm
- 50.3mm
- 55.2mm
- 65.5mm
- 68.1mm
- 69.9mm
- 72.5mm
- 95.7mm
Material
- Glass, Polyester, Thermoplastic
- Polyester
Material Flammability Rating
- UL94 V-0
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Not Applicable
Mount
- Socket
- Surface Mount
- Through Hole
- Through Hole, Wire
- Wire
Mounting Type
- Surface Mount
- Through Hole
Number of Contacts
- 10
- 100
- 12
- 128
- 132
- 14
- 144
- 16
- 160
- 18
- 20
- 200
- 208
- 22
- 24
- 28
- 32
- 36
- 40
- 42
- 44
- 48
- 52
- 56
- 64
- 68
- 8
- 80
- 84
- 90
Number of Pins
- 10
- 100
- 12
- 128
- 132
- 14
- 144
- 16
- 160
- 169
- 18
- 184
- 20
- 208
- 22
- 24
- 26
- 28
- 32
- 36
- 40
- 42
- 44
- 48
- 52
- 56
- 60
- 64
- 68
- 8
- 80
- 84
- 90
Number of Positions
- 10
- 12
- 14
- 144
- 16
- 160
- 18
- 20
- 22
- 24
- 26
- 28
- 32
- 40
- 42
- 48
- 56
- 64
- 90
- 95
Number of Rows
- 1
- 2
Orientation
- Straight
Package / Case
- PLCC
- QFP
- SOIC
- TO-8
- TSOP
Packaging
- Box
- Bulk
Part Status
- Active
- Obsolete
Pbfree Code
- no
- yes
PCB Contact Pattern
- RECTANGULAR
PCB Contact Row Spacing
- 0.3 mm
- 0.6 mm
Pitch
- 1.778mm
- 1.78mm
- 2.54mm
Pitch - Mating
- 0.020 0.50mm
- 0.024 0.60mm
- 0.025 0.64mm
- 0.026 0.65mm
- 0.031 0.80mm
- 0.050 1.27mm
- 0.070 1.78mm
- 0.100 2.54mm
Pitch - Post
- 0.031 0.80mm
- 0.050 1.27mm
- 0.070 1.78mm
- 0.100 2.54mm
Published
- 2000
- 2001
- 2002
- 2003
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2017
- 2018
Radiation Hardening
- No
REACH SVHC
- No SVHC
RoHS Status
- Non-RoHS Compliant
- RoHS Compliant
- ROHS3 Compliant
Row Spacing
- 10.16 mm
- 15.24 mm
- 2.54 mm
- 20.32 mm
- 22.86 mm
- 25.4 mm
- 3.81 mm
- 7.62 mm
Sensing Distance
- 3 m
Series
- 647
- DS9075
Termination
- Solder
- Wire Wrap
Termination Post Length
- 0.030 0.76mm
- 0.031 0.80mm
- 0.080 2.03mm
- 0.089 2.28mm
- 0.090 2.29mm
- 0.125 3.18mm
- 0.130 3.30mm
- 0.145 3.68mm
- 0.150 3.81mm
- 0.180 4.57mm
- 0.236 6.00mm
- 0.620 15.75mm
Voltage - Rated
- 1kV
Weight
- 453.59237g
- 680.388555g
Width
- 24.4mm
- 27.9mm
- 32.3mm
- 32mm
- 38.5mm
- 43.2mm
- 6.9mm
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Housing Material | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Number of Positions | ECCN Code | Max Operating Temperature | Min Operating Temperature | Gender | Contact Finish - Mating | Orientation | Depth | Number of Contacts | Length | RoHS Status | Flammability Rating | Lead Free | Contact Material | Contact Plating | Current Rating | Number of Pins | Additional Feature | Package / Case | REACH SVHC | Lead Pitch | Height | Width | Mounting Type | Weight | Operating Temperature | Lead Length | JESD-609 Code | Body Material | Body Breadth | Number of Rows | PCB Contact Pattern | Body Depth | Contact Style | Feature | Pitch | Current Rating (Amps) | PCB Contact Row Spacing | Material Flammability Rating | Row Spacing | Device Socket Type | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Material - Mating | Contact Material - Post | Termination Post Length | Pitch - Post | Convert From (Adapter End) | Convert To (Adapter End) | Board Material | Core Architecture |
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24-651000-10 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | 2006 | Correct-A-Chip® 651000 | Active | 1 (Unlimited) | Solder | EAR99 | 36 | Non-RoHS Compliant | 1A | 24 | SOCKET ADAPTER | Through Hole | 3.683mm | e0 | IC SOCKET | 0.026 0.65mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.145 3.68mm | 0.100 2.54mm | SSOP | DIP, 0.6 (15.24mm) Row Spacing | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
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LCQT-QFP0.5-40-1 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | Polyester | Correct-A-Chip® | Active | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | UL94 V-0 | Lead Free | 40 | QFP | No SVHC | Through Hole | -55°C~125°C | 5.9944mm | UL94 V-0 | 0.020 0.50mm | Gold | Flash | Brass | 0.236 6.00mm | 0.100 2.54mm | Multiple Packages | QFP | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
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68-505-110-RC | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | 2013 | Correct-A-Chip® 505 | Active | 1 (Unlimited) | Solder | ROHS3 Compliant | 68 | PLCC | Through Hole | 3.81mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.150 3.81mm | 0.050 1.27mm | PLCC | PGA | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||
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48-655000-10 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | 2006 | Correct-A-Chip® 655000 | Obsolete | 1 (Unlimited) | Solder | 48 | Silver | Non-RoHS Compliant | Silver | 48 | TSOP | Through Hole | 3.175mm | 0.020 0.50mm | Tin-Lead | 200.0μin 5.08μm | Copper | Brass | 0.125 3.18mm | 0.100 2.54mm | TSOP | DIP, 0.6 (15.24mm) Row Spacing | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||
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16-354000-10 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Polyamide (PA46), Nylon 4/6, Glass Filled | 2012 | Correct-A-Chip® 354000 | Active | 1 (Unlimited) | Solder | EAR99 | Gold | 16 | Non-RoHS Compliant | UL94 V-0 | Tin | 3A | 16 | STANDARD: UL 94V-0 | Surface Mount | 105°C | e3 | 2 | UL94 V-0 | 7.62 mm | IC SOCKET | 0.100 2.54mm | 10.0μin 0.25μm | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | ||||||||||||||||||||||||||||||||||
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26-665000-00 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | 2006 | Correct-A-Chip® 665000 | Active | 1 (Unlimited) | Solder | 26 | Non-RoHS Compliant | 26 | SOIC | Surface Mount | 787.4μm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.031 0.80mm | 0.050 1.27mm | SOIC-W | SOIC | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||
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240-3639-19-0602J | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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18-354000-10 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Polyamide (PA46), Nylon 4/6, Glass Filled | 2006 | Correct-A-Chip® 354000 | Active | 1 (Unlimited) | Solder | 18 | Gold | ROHS3 Compliant | UL94 V-0 | Gold | 3A | 18 | SOIC | Surface Mount | 3A | UL94 V-0 | 0.100 2.54mm | Gold | 10.0μin 0.25μm | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | ||||||||||||||||||||||||||||||||||||
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220-3342-09-0602J | Artery | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Through Hole | Polysulfone (PSU), Glass Filled | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | 20 | 150°C | -55°C | Female | Gold | 20 | RoHS Compliant | UL94 V-0 | Lead Free | Copper | Gold | 1A | 20 | Through Hole | -55°C~125°C | Closed Frame | 2.54mm | 1A | UL94 V-0 | 0.100 2.54mm | Gold | 30.0μin 0.76μm | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | |||||||||||||||||||||||||||
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32-653000-11-RC | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | 2006 | Correct-A-Chip® 653000 | yes | Active | 1 (Unlimited) | Solder | EAR99 | 32 | ROHS3 Compliant | UL94 V-0 | Lead Free | 1A | 32 | UL 94V-0 | No SVHC | Through Hole | 3.175mm | e4 | Socket Included | UL94 V-0 | 15.24 mm | IC SOCKET | 0.050 1.27mm | Gold | 10.0μin 0.25μm | Brass | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.6 (15.24mm) Row Spacing | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||
![]() |
28-350002-11-RC | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2006 | Correct-A-Chip® 350000 | Active | 1 (Unlimited) | Solder | 28 | 28 | 35.6mm | ROHS3 Compliant | Lead Free | Brass | Gold | 28 | No SVHC | 1.58mm | Through Hole | 3.81 mm | 0.050 1.27mm | Gold | 10.0μin 0.25μm | Brass | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||
![]() |
16-350000-10-HT | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Through Hole | POLYAMIDE | 2005 | Correct-A-Chip® 350000 | Active | 1 (Unlimited) | Solder | 16 | EAR99 | Tin | Straight | 16 | Non-RoHS Compliant | SOCKET ADAPTER | Through Hole | 3.175mm | High Temperature | IC SOCKET | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Polyimide (PI) | ||||||||||||||||||||||||||||||||||||
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1111841 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | 2009 | Correct-A-Chip® 1111841 | Active | 1 (Unlimited) | Solder | EAR99 | 10 | Non-RoHS Compliant | Lead Free | Tin | 10 | UL 94V-0 | Through Hole | 105°C | e3 | 2 | IC SOCKET | 0.020 0.50mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.125 3.18mm | 0.100 2.54mm | MSOP | DIP, 0.3 (7.62mm) Row Spacing | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||
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28-505-111 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | 2006 | Correct-A-Chip® 505 | Active | 1 (Unlimited) | Solder | EAR99 | GOLD (10) | 28 | Non-RoHS Compliant | 28 | SOCKET ADAPTER | Through Hole | 3.81mm | e4 | IC SOCKET | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.150 3.81mm | 0.050 1.27mm | PLCC | PGA | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
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1107254-32 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | 2006 | Correct-A-Chip® 1107254 | yes | Active | 1 (Unlimited) | Solder | EAR99 | Gold | 32 | ROHS3 Compliant | UL94 V-0 | 3A | 32 | SOCKET ADAPTER | 2.54mm | Through Hole | 3.302mm | e3 | 0.7 inch | 2 | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | IC SOCKET | 0.100 2.54mm | Tin | 30.0μin 0.76μm | 200.0μin 5.08μm | Beryllium Copper | Brass | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | |||||||||||||||||||||||||
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14-354W00-20 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Polyamide (PA46), Nylon 4/6, Glass Filled | 2012 | Correct-A-Chip® 354W00 | Active | 1 (Unlimited) | Solder | EAR99 | Gold | 14 | ROHS3 Compliant | 14 | STANDARD: UL 94V-0 | Through Hole | 105°C | e0 | 3A | UL94 V-0 | IC SOCKET | 0.100 2.54mm | Tin-Lead | 10.0μin 0.25μm | 200.0μin 5.08μm | Beryllium Copper | Brass | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | ||||||||||||||||||||||||||||||||||||
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1106396-36 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | 2006 | Correct-A-Chip® 1106396 | yes | Active | 1 (Unlimited) | Solder | EAR99 | Gold | 36 | ROHS3 Compliant | UL94 V-0 | 3A | 36 | SOCKET ADAPTER | 2.54mm | Through Hole | 3.302mm | e3 | 2 | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | IC SOCKET | 0.100 2.54mm | Tin | 30.0μin 0.76μm | 200.0μin 5.08μm | Beryllium Copper | Brass | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | |||||||||||||||||||||||||||
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20-350000-10-HT | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Through Hole | POLYAMIDE | 2005 | Correct-A-Chip® 350000 | Active | 1 (Unlimited) | Solder | EAR99 | Tin | 20 | Non-RoHS Compliant | 20 | SOCKET ADAPTER | Through Hole | 3.175mm | High Temperature | IC SOCKET | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Polyimide (PI) | |||||||||||||||||||||||||||||||||||||
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12-350000-10-HT | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Through Hole | 2005 | Correct-A-Chip® 350000 | Active | 1 (Unlimited) | Solder | 12 | Tin | Non-RoHS Compliant | Tin | 12 | SOIC | Through Hole | 3.175mm | High Temperature | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Polyimide (PI) | |||||||||||||||||||||||||||||||||||||||
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18-354000-11-RC | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Polyamide (PA46), Nylon 4/6, Glass Filled | 2009 | Correct-A-Chip® 354000 | Active | 1 (Unlimited) | Solder | Gold | ROHS3 Compliant | UL94 V-0 | Gold | 3A | 18 | Surface Mount | 762μm | 3A | UL94 V-0 | 0.100 2.54mm | Gold | 10.0μin 0.25μm | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.030 0.76mm | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | ||||||||||||||||||||||||||||||||||||
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16-307349-11-RC-P (170 UP) | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Correct-A-Chip® 307349 | Active | 1 (Unlimited) | Solder | Gold | ROHS3 Compliant | 16 | Through Hole | 0.050 1.27mm | 10.0μin 0.25μm | Brass | 0.125 3.18mm | 0.100 2.54mm | PLCC | DIP, 0.3 (7.62mm) Row Spacing | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||
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240-3639-09-0602J | Artery | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Through Hole | Polysulfone (PSU), Glass Filled | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | 40 | 150°C | -55°C | Female | Gold | Straight | 40 | RoHS Compliant | UL94 V-0 | Lead Free | Copper | Gold | 1A | 40 | Through Hole | -55°C~125°C | Glass, Polysulfone | Closed Frame | 2.54mm | 1A | UL94 V-0 | 25.4 mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.130 3.30mm | 0.100 2.54mm | DIP, 1.0 (25.40mm) Row Spacing | DIP, 1.0 (25.40mm) Row Spacing | ||||||||||||||||||||||||
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08-350000-10-HT | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | POLYAMIDE | 2006 | Correct-A-Chip® 350000 | Active | 1 (Unlimited) | Solder | EAR99 | Tin | 8 | Non-RoHS Compliant | 8 | 2.54mm | Through Hole | e0 | 2 | IC SOCKET | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | Brass | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Polyimide (PI) | ||||||||||||||||||||||||||||||||||||||
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216-3340-19-0602J | Artery | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Wire | Polysulfone (PSU), Glass Filled | 2011 | Textool™ | Active | 1 (Unlimited) | Wire Wrap | 16 | 150°C | -55°C | Female | Gold | 16 | RoHS Compliant | UL94 V-0 | Lead Free | Copper | Gold | 1A | 16 | Through Hole | 453.59237g | -55°C~125°C | Closed Frame | 2.54mm | 1A | UL94 V-0 | 0.100 2.54mm | Gold | 30.0μin 0.76μm | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | ||||||||||||||||||||||||||
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218-3341-09-0602J | Artery | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Through Hole | Polysulfone (PSU), Glass Filled | 2001 | Textool™ | Active | 1 (Unlimited) | Solder | 18 | 150°C | -55°C | Female | Gold | 18 | RoHS Compliant | UL94 V-0 | Lead Free | Copper | Gold | 1A | 18 | Through Hole | -55°C~125°C | 2.54mm | 1A | UL94 V-0 | 0.100 2.54mm | Gold | 30.0μin 0.76μm | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.130 3.30mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | ||||||||||||||||||||||||||||
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MIKROE-230 | MikroElektronika | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Socket | Active | 1 (Unlimited) | Non-RoHS Compliant | 40 | AT90PWM1 | DIP | AVR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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28-35W000-11-RC | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | 2012 | Correct-A-Chip® 35W000 | yes | Active | 1 (Unlimited) | Solder | EAR99 | 28 | ROHS3 Compliant | Lead Free | 28 | SOCKET ADAPTER | SOIC | Through Hole | 3.175mm | e4 | IC SOCKET | Gold | 10.0μin 0.25μm | Brass | 0.125 3.18mm | 0.050 1.27mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||
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PA-SOD6SM18-44 | Logical Systems Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Active | Not Applicable | Solder | RoHS Compliant | 44 | Through Hole | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | SOIC | DIP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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220-3342-19-0602J | Artery | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Through Hole, Wire | Polysulfone (PSU), Glass Filled | 2011 | Textool™ | Active | 1 (Unlimited) | Wire Wrap | 20 | 150°C | -55°C | Female | Gold | 25.4mm | 20 | 40.1mm | RoHS Compliant | UL94 V-0 | Lead Free | Copper | Gold | 1A | 20 | 6.9mm | Through Hole | 453.59237g | -55°C~125°C | Closed Frame | 2.54mm | 1A | UL94 V-0 | 0.100 2.54mm | Gold | 30.0μin 0.76μm | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.620 15.75mm | 0.100 2.54mm | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | |||||||||||||||||||||||
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1109523 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Polyamide (PA46), Nylon 4/6, Glass Filled | 2007 | Correct-A-Chip® 1109523 | Active | 1 (Unlimited) | Solder | EAR99 | Gold | 8 | 10.2mm | Non-RoHS Compliant | Contains Lead | 8 | STANDARD: UL 94V-0 | TO-8 | 5.85mm | Through Hole | e0 | Socket Included | 1A | UL94 V-0 | IC SOCKET | 0.100 2.54mm | Tin-Lead | 10.0μin 0.25μm | 200.0μin 5.08μm | Beryllium Copper | Brass | 0.125 3.18mm | DIP, 0.3 (7.62mm) Row Spacing | JEDEC | FR4 Epoxy Glass |
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24-651000-10 Aries Electronics
IC & Component Sockets SSOP IC TO DIP ADAPT 651000 SERIES
Price: 0.0000
RFQ -
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48-655000-10 Aries Electronics
IC & Component Sockets TSOP TO DIP ADAPT 655000 SERIES
Price: 0.0000
RFQ -
16-354000-10 Aries Electronics
IC & Component Sockets 16P DIP TO SOIC ADAPTER SHORT PIN
Price: 0.0000
RFQ -
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32-653000-11-RC Aries Electronics
ARIES 32-653000-11-RC ADAPTOR, PLCC TO DIL, 32WAY
Price: 0.0000
RFQ -
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16-350000-10-HT Aries Electronics
IC & Component Sockets HITEMP SOIC DIP ADAP 16 PINS
Price: 0.0000
RFQ -
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14-354W00-20 Aries Electronics
IC & Component Sockets DIP TO SOWIC ADAPT 354W00 SERIES
Price: 0.0000
RFQ -
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20-350000-10-HT Aries Electronics
IC & Component Sockets HITEMP SOIC DIP ADAP 20 PINS
Price: 0.0000
RFQ -
12-350000-10-HT Aries Electronics
IC & Component Sockets HITEMP SOIC DIP ADAP 12 PINS
Price: 0.0000
RFQ -
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