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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Connector Type Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
24-350000-10-HT 24-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 8 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 no Active 1 (Unlimited) Solder EAR99 Tin 24 Non-RoHS Compliant 24 SOCKET ADAPTER Through Hole 3.175mm e0 High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
10-350000-10-HT 10-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 10 Tin Non-RoHS Compliant Tin 10 SOIC Through Hole 3.175mm High Temperature 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
240-1280-39-0602J 240-1280-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2006 Textool™ Active 1 (Unlimited) Wire Wrap 40 150°C -55°C Female Gold 40 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
08-354000-11-RC 08-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant UL94 V-0 3A 8 SOCKET ADAPTER, UL 94V-0 Surface Mount 762μm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
24-666000-00 24-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 24 Non-RoHS Compliant 24 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
PA-TS1D6SM18-56 PA-TS1D6SM18-56 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks 2006 Active Not Applicable Solder RoHS Compliant 56 Through Hole 0.020 0.50mm 0.125 3.18mm 0.100 2.54mm TSOP DIP
1107254-40 1107254-40 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A 40 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
16-354W00-10 16-354W00-10 0.0000
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0.00000000
44-505-110 44-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 44 Non-RoHS Compliant 44 SOCKET ADAPTER Through Hole 3.81mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
MIKROE-231 MIKROE-231 MikroElektronika 0.0000
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0.00000000 Obsolete 1 (Unlimited) 40 AT90PWM2 DIP
44-305263-20 44-305263-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 305263 Active 1 (Unlimited) Solder EAR99 44 19.4mm Non-RoHS Compliant Lead Free 44 SOCKET ADAPTER 1.58mm Through Hole e3 IC SOCKET 0.024 0.60mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.050 1.27mm QFP PLCC FR4 Epoxy Glass
228-1277-19-0602J 228-1277-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 32mm 28 50.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 6.9mm Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
800-3-6-1 800-3-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
216-3340-09-0602J 216-3340-09-0602J Artery 0.0000
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Min: 1

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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) DIP, Socket Solder 16 150°C -55°C Female Gold 16 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 16 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
800-19-6-1 800-19-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
52-505-110 52-505-110 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 2006 Correct-A-Chip® 505 Obsolete Not Applicable Solder EAR99 52 22.2mm Non-RoHS Compliant Lead Free 52 SOCKET ADAPTER 1.58mm Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
18-350000-10-HT 18-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 18 Non-RoHS Compliant 18 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
95-100I25 95-100I25 Aries Electronics 0.0000
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0.00000000 download 2001 Obsolete 1 (Unlimited) Solder EAR99 Tin 100 34.3mm RoHS Compliant Lead Free Brass 100 SOCKET ADAPTER 2.39mm Through Hole 2.54 mm IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
20-350001-10 20-350001-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead 20 SOCKET ADAPTER SOIC 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.050 1.27mm Tin 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
68-652000-11-RC 68-652000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 68 ROHS3 Compliant 1A 68 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
1106396-16 1106396-16 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2007 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A 16 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
242-1293-09-0602J 242-1293-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 42 150°C -55°C Female Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole -55°C~125°C Closed Frame 1.778mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
28-354000-11-RC 28-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 Copper 3A 28 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
14-666000-00 14-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 14 Non-RoHS Compliant Tin 14 UL 94V-0 Surface Mount 2.032mm e0 2 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
240-1280-09-0602J 240-1280-09-0602J Artery 0.0000
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Min: 1

Mult: 1

0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 40 150°C -55°C Female Gold Straight 6.9mm 40 65.5mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 40 32.3mm Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
290-1294-09-0602J 290-1294-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 90 150°C -55°C Female Gold 90 95.7mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 90 6.9mm Through Hole 680.388555g -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
290-1294-29-0602J 290-1294-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 90 150°C -55°C Female Gold 90 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 90 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
28-450001-10 28-450001-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 450001 Active 1 (Unlimited) Solder EAR99 TIN LEAD 28 35.6mm Non-RoHS Compliant Lead Free 28 SOCKET ADAPTER 1.58mm Through Hole e0 IC SOCKET 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
16-307349-11-RC 16-307349-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 307349 Active 1 (Unlimited) Solder EAR99 Gold ROHS3 Compliant 16 Through Hole 3.175mm IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
224-5248-09-0602J 224-5248-09-0602J Artery 0.0000
RFQ

Min: 1

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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold 24 RoHS Compliant Lead Free Copper Gold 24 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
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