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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
232-1285-09-0602J 232-1285-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold Straight 6.9mm 32 55.2mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 32 32mm Through Hole -55°C~125°C 1GOhm Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
20-555000-00 20-555000-00 Aries Electronics 0.0000
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0.00000000 6 Weeks 2009 Correct-A-Chip® 555000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant Lead Free 20 SOCKET ADAPTER Surface Mount 105°C e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.050 1.27mm SSOP SOWIC FR4 Epoxy Glass
232-1285-39-0602J 232-1285-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 Gold Straight 32 RoHS Compliant Lead Free Copper Gold No 32 Through Hole -55°C~125°C 2 Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
08-301296-10 08-301296-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 301296 Active 1 (Unlimited) Solder EAR99 105°C -55°C 8 Non-RoHS Compliant Lead Free Tin 8 Through Hole 3.175mm e3 1 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm SOIC JEDEC FR4 Epoxy Glass
240-1280-09-0602J 240-1280-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 40 150°C -55°C Female Gold Straight 6.9mm 40 65.5mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 40 32.3mm Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
18-350000-10-HT 18-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 18 Non-RoHS Compliant 18 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
MIKROE-231 MIKROE-231 MikroElektronika 0.0000
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0.00000000 Obsolete 1 (Unlimited) 40 AT90PWM2 DIP
1110267-N 1110267-N Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1110267-N Active 1 (Unlimited) Solder EAR99 64 Non-RoHS Compliant 68 SOCKET ADAPTER Through Hole e0 IC SOCKET Tin-Lead 200.0μin 5.08μm Brass 0.100 2.54mm PLCC DIP, 0.9 (22.86mm) Row Spacing FR4 Epoxy Glass
28-354000-21-RC 28-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 3A 28 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
08-354000-10 08-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 8 Non-RoHS Compliant UL94 V-0 Tin 3A 8 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
28-352000-10 28-352000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole RYTON 2007 Correct-A-Chip® 352000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 28 Non-RoHS Compliant 1A 28 Through Hole 3.175mm e3 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
224-1275-09-0602J 224-1275-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold Straight 6.9mm 24 45mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 24 32mm Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
1106396-28 1106396-28 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 35.6mm ROHS3 Compliant Lead Free Copper Gold, Tin SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 2 RECTANGULAR RND PIN-SKT 3A UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
228-1277-39-0602J 228-1277-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
44-505-110 44-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 44 Non-RoHS Compliant 44 SOCKET ADAPTER Through Hole 3.81mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
LCQT-QFP0.8-32 LCQT-QFP0.8-32 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 32 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.031 0.80mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
24-666000-00 24-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 24 Non-RoHS Compliant 24 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
20-351000-10 20-351000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead Tin 1A 20 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
240-1280-39-0602J 240-1280-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2006 Textool™ Active 1 (Unlimited) Wire Wrap 40 150°C -55°C Female Gold 40 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
PA-TS1D6SM18-56 PA-TS1D6SM18-56 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks 2006 Active Not Applicable Solder RoHS Compliant 56 Through Hole 0.020 0.50mm 0.125 3.18mm 0.100 2.54mm TSOP DIP
08-354000-11-RC 08-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant UL94 V-0 3A 8 SOCKET ADAPTER, UL 94V-0 Surface Mount 762μm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
08-305479-10 08-305479-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Box 2009 Correct-A-Chip® 305479 Active 1 (Unlimited) Solder EAR99 8 Non-RoHS Compliant Lead Free 8 Through Hole 3.175mm e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm SOIC JEDEC FR4 Epoxy Glass
16-354W00-10 16-354W00-10 0.0000
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0.00000000
1106396-20 1106396-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2007 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
218-3341-19-0602J 218-3341-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Wire Wrap 18 150°C -55°C Female Gold 18 RoHS Compliant Lead Free Copper Gold 18 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
97-68340 97-68340 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 97-68340 Active 1 (Unlimited) Solder EAR99 Tin 144 39.4mm Non-RoHS Compliant Lead Free 144 SOCKET ADAPTER 2.39mm Through Hole IC SOCKET 0.026 0.65mm 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
10-350000-10-HT 10-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 10 Tin Non-RoHS Compliant Tin 10 SOIC Through Hole 3.175mm High Temperature 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
14-354000-20 14-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 14 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 14 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1107254-28 1107254-28 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 35.6mm ROHS3 Compliant Lead Free Copper SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 3A UL94 V-0 15.24 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
16-307349-11-RC 16-307349-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 307349 Active 1 (Unlimited) Solder EAR99 Gold ROHS3 Compliant 16 Through Hole 3.175mm IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
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