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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Cable Length Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Sensing Distance Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
224-5248-09-0602J 224-5248-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold 24 RoHS Compliant Lead Free Copper Gold 24 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
1110267-N 1110267-N Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1110267-N Active 1 (Unlimited) Solder EAR99 64 Non-RoHS Compliant 68 SOCKET ADAPTER Through Hole e0 IC SOCKET Tin-Lead 200.0μin 5.08μm Brass 0.100 2.54mm PLCC DIP, 0.9 (22.86mm) Row Spacing FR4 Epoxy Glass
1106396-28 1106396-28 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 35.6mm ROHS3 Compliant Lead Free Copper Gold, Tin SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 2 RECTANGULAR RND PIN-SKT 3A UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
08-354000-21-RC 08-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant UL94 V-0 3A 8 SOCKET ADAPTER, UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
32-450001-10-P 32-450001-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 450001 Active 1 (Unlimited) Solder 32 Non-RoHS Compliant Contains Lead 32 SOIC Through Hole 3.175mm 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
68-505-110-RC-P 68-505-110-RC-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2013 Correct-A-Chip® 505 Active 1 (Unlimited) Solder ROHS3 Compliant 68 PLCC Through Hole 3.81mm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
232-1285-09-0602J 232-1285-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold Straight 6.9mm 32 55.2mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 32 32mm Through Hole -55°C~125°C 1GOhm Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
1106396-20 1106396-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2007 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
1111163 1111163 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 1111163 Active 1 (Unlimited) EAR99 Gold 40 Non-RoHS Compliant UL94 V-0 Gold, Tin 40 SOCKET ADAPTER, UL 94V-0 2.54mm e3 2.54mm UL94 V-0 IC SOCKET 10.0μin 0.25μm Brass Socket, 0.6 (15.24mm) Row Spacing PLCC FR4 Epoxy Glass
20-351000-10 20-351000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead Tin 1A 20 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
18-665000-00 18-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
28-354000-20 28-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 28 ROHS3 Compliant UL94 V-0 Lead Free Tin 3A 28 STANDARD: UL 94V-0 1.58mm Surface Mount e3 2 2.54mm UL94 V-0 7.62 mm IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
218-3341-19-0602J 218-3341-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Wire Wrap 18 150°C -55°C Female Gold 18 RoHS Compliant Lead Free Copper Gold 18 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
16-304633-18 16-304633-18 Aries Electronics 0.0000
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0.00000000 6 Weeks 2009 Correct-A-Chip® 304633 Active 1 (Unlimited) Solder EAR99 16 Non-RoHS Compliant 16 SOCKET ADAPTER Through Hole 105°C e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
1107254-08 1107254-08 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant UL94 V-0 3A 8 SOCKET ADAPTER, UL 94V-0 2.54mm Through Hole 3.302mm e0 2 UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
1107254-18 1107254-18 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 3A 18 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
1106396-40 1106396-40 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2013 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A 40 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
08-301296-10 08-301296-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 301296 Active 1 (Unlimited) Solder EAR99 105°C -55°C 8 Non-RoHS Compliant Lead Free Tin 8 Through Hole 3.175mm e3 1 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm SOIC JEDEC FR4 Epoxy Glass
224-5248-19-0602J 224-5248-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold Straight 6.9mm 24 3m RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 24 24.4mm Through Hole 453.59237g -55°C~125°C 3m Glass, Polysulfone 2.54mm 3m 1A UL94 V-0 3 m 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
84-652000-10 84-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 1A 84 UL 94V-0 Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
20-354W00-10 20-354W00-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 20 25.4mm ROHS3 Compliant Lead Free 20 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
214-3339-19-0602J 214-3339-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 14 150°C -55°C Female Gold Straight 14 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 14 Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2 Closed Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
68-653000-10 68-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 no Active 1 (Unlimited) Solder EAR99 105°C -55°C 68 Non-RoHS Compliant Contains Lead Tin 1A 68 UL 94V-0 6.08mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
1107254-28 1107254-28 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 35.6mm ROHS3 Compliant Lead Free Copper SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 3A UL94 V-0 15.24 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
28-450001-11-RC 28-450001-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 450001 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant 28 SOCKET ADAPTER Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
28-354000-21-RC 28-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 3A 28 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
24-650000-10-P 24-650000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder Non-RoHS Compliant 24 SOIC Through Hole 3.175mm 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
224-1275-29-0602J 224-1275-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold 24 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 24 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
97-56001-P 97-56001-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 97-56001 Active 1 (Unlimited) Solder Gold 132 Non-RoHS Compliant 169 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
248-1282-29-0602J 248-1282-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
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