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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Published Series Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Contact Finish - Mating Number of Contacts RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case Height Mounting Type Lead Length JESD-609 Code Number of Rows Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
32-450001-10 32-450001-10 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks 2006 Correct-A-Chip® 450001 Active 1 (Unlimited) Solder EAR99 105°C -55°C 32 Non-RoHS Compliant Contains Lead Brass Tin 32 SOCKET ADAPTER SOIC 1.58mm Through Hole e0 2 10.16 mm IC SOCKET 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
84-505-110 84-505-110 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 84 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
7131-108-18 7131-108-18 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 6 Weeks Through Hole 2013 Active 1 (Unlimited) Solder ROHS3 Compliant 8 Through Hole 3.175mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm HB2E Relay DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
68-652000-10 68-652000-10 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 68 Non-RoHS Compliant Tin 1A 68 UL 94V-0 Through Hole 3.175mm e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
18-354000-10 18-354000-10 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder 18 Gold ROHS3 Compliant UL94 V-0 Gold 3A 18 SOIC Surface Mount 3A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
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