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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Number of Contacts RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Mounting Type Operating Temperature Lead Length JESD-609 Code Number of Rows Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
1111841-8 1111841-8 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1111841 Active 1 (Unlimited) Solder EAR99 105°C -55°C 8 Non-RoHS Compliant Tin 8 UL 94V-0 Through Hole 3.175mm e0 2 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm MSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
20-354000-11-RC 20-354000-11-RC Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 Copper 3A 20 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1109522 1109522 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1109522 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 8 Non-RoHS Compliant UL94 V-0 3A 8 STANDARD: UL 94V-0 TO-8 2.54mm Through Hole 3.175mm e0 2 UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing JEDEC FR4 Epoxy Glass
24-651000-10 24-651000-10 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 36 Non-RoHS Compliant 1A 24 SOCKET ADAPTER Through Hole 3.683mm e0 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
218-3341-09-0602J 218-3341-09-0602J Artery 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 18 150°C -55°C Female Gold 18 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 18 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
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