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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Operating Temperature Insulation Resistance Lead Length JESD-609 Code Number of Rows PCB Contact Pattern Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
20-665000-00 20-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant 20 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
28-555000-00 28-555000-00 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Surface Mount 2006 Correct-A-Chip® 555000 Active 1 (Unlimited) Solder EAR99 28 Non-RoHS Compliant 28 SOCKET ADAPTER Surface Mount e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.050 1.27mm SSOP SOWIC FR4 Epoxy Glass
14-354000-10 14-354000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2011 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 14 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 14 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
16-354000-20 16-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 16 ROHS3 Compliant UL94 V-0 Lead Free Tin 3A 16 STANDARD: UL 94V-0 1.58mm Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
28-650000-10-P 28-650000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2010 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder 28 35.6mm Non-RoHS Compliant 28 SOIC 1.58mm Through Hole 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
97-AQ132D-P 97-AQ132D-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 97-AQ132D Active 1 (Unlimited) Solder EAR99 Gold 132 ROHS3 Compliant 132 SOCKET ADAPTER Through Hole 105°C e0 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm PQFP PGA FR4 Epoxy Glass
48-6645-18 48-6645-18 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 6645 Active 1 (Unlimited) Solder EAR99 48 Non-RoHS Compliant 48 ADAPTER Through Hole e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm TQFP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
95-132I25-P 95-132I25-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 95-132I25 Active 1 (Unlimited) Solder EAR99 Tin 132 Non-RoHS Compliant 132 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
800-12-6-1 800-12-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
248-1282-09-0602J 248-1282-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
24-351000-10 24-351000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 24 Non-RoHS Compliant Lead Free Tin 1A 24 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
16-354000-21-RC 16-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A 16 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1109342 1109342 Aries Electronics 0.0000
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0.00000000 6 Weeks Polyphenylene Sulfide (PPS) 2017 Correct-A-Chip® 1109342 Active 1 (Unlimited) Solder EAR99 Tin 40 Non-RoHS Compliant Lead Free 44 SOCKET ADAPTER, 94V-0 2.54mm Through Hole 105°C e3 2.54mm UL94 V-0 IC SOCKET Tin-Lead 150.0μin 3.81μm 200.0μin 5.08μm Phosphor Bronze Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
20-301550-10 20-301550-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 301550 Active 1 (Unlimited) Solder EAR99 32 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 762μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.030 0.76mm 0.100 2.54mm SOIC PLCC FR4 Epoxy Glass
1109252 1109252 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1109252 Active 1 (Unlimited) Solder 56 EAR99 56 Non-RoHS Compliant 28 Through Hole 3.175mm e3 IC SOCKET Tin-Lead Brass 0.125 3.18mm 0.070 1.78mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
UPD4722GS-GJG UPD4722GS-GJG 0.0000
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0.00000000 download
32-652000-10-P 32-652000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder Non-RoHS Compliant Lead Free 1A 32 PLCC Through Hole 3.175mm 1A 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-351000-11-RC 24-351000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2007 Correct-A-Chip® 351000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant 24 SOCKET ADAPTER No SVHC Through Hole 3.175mm e4 7.62 mm IC SOCKET 0.026 0.65mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
20-350001-11-RC 20-350001-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 350000 yes Active 1 (Unlimited) Solder EAR99 GOLD (10) OVER NICKEL (100) 20 25.4mm ROHS3 Compliant Lead Free 20 SOCKET ADAPTER SOIC 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm Tin 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
96-128M80 96-128M80 Aries Electronics 0.0000
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0.00000000 Correct-A-Chip® Obsolete 1 (Unlimited) Solder EAR99 Tin 128 Non-RoHS Compliant 128 SOCKET ADAPTER Through Hole 105°C IC SOCKET 0.031 0.80mm Tin-Lead 200.0μin 5.08μm Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
24-354000-20 24-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
44-653000-10 44-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 44 Non-RoHS Compliant Contains Lead Tin 1A 44 UL 94V-0 1.58mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
36-651000-10 36-651000-10 Aries Electronics 0.0000
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0.00000000 download 6 Weeks 2012 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 Tin 36 Non-RoHS Compliant 36 SOCKET ADAPTER Through Hole 105°C e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
264-4493-19-0602J 264-4493-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 64 150°C -55°C Gold 43.2mm 64 100.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 64 6.9mm Through Hole -55°C~125°C 1GOhm 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
24-354000-10 24-354000-10 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
24-35W000-11-RC 24-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 24 ROHS3 Compliant 24 SOCKET ADAPTER Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
24-354000-11-RC 24-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2007 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant UL94 V-0 3A 24 STANDARD: UL 94V-0 Surface Mount 762μm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1106396-14 1106396-14 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
14-354000-11-RC 14-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyester Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 Copper 3A 14 STANDARD: UL 94V-0 No SVHC Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
242-1281-39-0602J 242-1281-39-0602J Artery 0.0000
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0.00000000 download Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Obsolete 1 (Unlimited) Wire Wrap 42 150°C -55°C Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
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