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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Weight Operating Temperature Lead Length JESD-609 Code Body Material Number of Rows Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
800-12-6-1-3007 800-12-6-1-3007 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
LCQT-QFP0.5-40-1 LCQT-QFP0.5-40-1 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 40 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
1111903 1111903 0.0000
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0.00000000
228-4817-09-0602J 228-4817-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
32-653000-11-RC 32-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 32 ROHS3 Compliant UL94 V-0 Lead Free 1A 32 UL 94V-0 No SVHC Through Hole 3.175mm e4 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
20-301550-20 20-301550-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 301550 Active 1 (Unlimited) Solder EAR99 32 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 2.286mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.100 2.54mm SOIC PLCC FR4 Epoxy Glass
84-505-110 84-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 84 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
48-655000-10 48-655000-10 Aries Electronics 0.0000
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0.00000000 download Through Hole 2006 Correct-A-Chip® 655000 Obsolete 1 (Unlimited) Solder 48 Silver Non-RoHS Compliant Silver 48 TSOP Through Hole 3.175mm 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
12-350000-10-HT 12-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 12 Tin Non-RoHS Compliant Tin 12 SOIC Through Hole 3.175mm High Temperature 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
240-3639-09-0602J 240-3639-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 40 150°C -55°C Female Gold Straight 40 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 Through Hole -55°C~125°C Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 25.4 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 1.0 (25.40mm) Row Spacing DIP, 1.0 (25.40mm) Row Spacing
800-27-6-1 800-27-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
1111841 1111841 Aries Electronics 0.0000
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0.00000000 download 6 Weeks 2009 Correct-A-Chip® 1111841 Active 1 (Unlimited) Solder EAR99 10 Non-RoHS Compliant Lead Free Tin 10 UL 94V-0 Through Hole 105°C e3 2 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm MSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
28-353000-10 28-353000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole RYTON 2006 Correct-A-Chip® 353000 Active 1 (Unlimited) Solder EAR99 Tin-Lead 28 Non-RoHS Compliant UL94 V-0 Lead, Tin 1A 28 Through Hole 3.175mm e3 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm 200.0μin 5.08μm Phosphor Bronze Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
216-3340-19-0602J 216-3340-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 16 150°C -55°C Female Gold 16 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 16 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
16-354000-10 16-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 16 Non-RoHS Compliant UL94 V-0 Tin 3A 16 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
18-354000-11-RC 18-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 Gold 3A 18 Surface Mount 762μm 3A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
20-354000-11-RC 20-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 Copper 3A 20 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
228-4817-19-0602J 228-4817-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
24-651000-10 24-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 36 Non-RoHS Compliant 1A 24 SOCKET ADAPTER Through Hole 3.683mm e0 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
14-354W00-10 14-354W00-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 14 17.8mm ROHS3 Compliant Lead Free 14 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
218-3341-09-0602J 218-3341-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 18 150°C -55°C Female Gold 18 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 18 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
1109522 1109522 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1109522 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 8 Non-RoHS Compliant UL94 V-0 3A 8 STANDARD: UL 94V-0 TO-8 2.54mm Through Hole 3.175mm e0 2 UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing JEDEC FR4 Epoxy Glass
44-647-10 44-647-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Bulk 2002 647 Active 1 (Unlimited) Solder EAR99 Gold 44 69.9mm Non-RoHS Compliant Contains Lead 44 UL 94V-0 2.39mm Through Hole e4 3A IC SOCKET Tin 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Phosphor Bronze 0.180 4.57mm SOIC DIP, 0.6 (15.24mm) Row Spacing
14-350000-10-HT 14-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 14 Non-RoHS Compliant 14 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
16-350000-10-HT 16-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 16 EAR99 Tin Straight 16 Non-RoHS Compliant SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
228-1277-29-0602J 228-1277-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
16-307349-11-RC-P (170 UP) 16-307349-11-RC-P (170 UP) Aries Electronics 0.0000
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0.00000000 download 5 Weeks Correct-A-Chip® 307349 Active 1 (Unlimited) Solder Gold ROHS3 Compliant 16 Through Hole 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
220-3342-09-0602J 220-3342-09-0602J Artery 0.0000
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Min: 1

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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 20 150°C -55°C Female Gold 20 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 20 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
68-652000-10 68-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 68 Non-RoHS Compliant Tin 1A 68 UL 94V-0 Through Hole 3.175mm e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
32-655000-10-P 32-655000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 655000 Active 1 (Unlimited) Solder EAR99 Silver Non-RoHS Compliant 32 Through Hole 3.175mm IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
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