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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Number of Contacts RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Mounting Type Operating Temperature Lead Length JESD-609 Code Feature Pitch Current Rating (Amps) Material Flammability Rating Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
LCQT-QFP0.65-52 LCQT-QFP0.65-52 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 52 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.026 0.65mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
97-56001 97-56001 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 97-56001 Active 1 (Unlimited) Solder 144 Gold 132 Non-RoHS Compliant Contains Lead 169 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
242-1281-29-0602J 242-1281-29-0602J Artery 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 42 150°C -55°C Female Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
68-505-110-RC 68-505-110-RC Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole 2013 Correct-A-Chip® 505 Active 1 (Unlimited) Solder ROHS3 Compliant 68 PLCC Through Hole 3.81mm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
24-354000-21-RC 24-354000-21-RC Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant UL94 V-0 3A 24 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
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