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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Connector Type Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
18-35W000-10-P 18-35W000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder 18 Non-RoHS Compliant 18 SOIC Through Hole 3.175mm 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
20-354W00-20 20-354W00-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant 20 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
18-350000-10-HT 18-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 18 Non-RoHS Compliant 18 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
68-505-110-RC-P 68-505-110-RC-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2013 Correct-A-Chip® 505 Active 1 (Unlimited) Solder ROHS3 Compliant 68 PLCC Through Hole 3.81mm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
44-305263-20 44-305263-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 305263 Active 1 (Unlimited) Solder EAR99 44 19.4mm Non-RoHS Compliant Lead Free 44 SOCKET ADAPTER 1.58mm Through Hole e3 IC SOCKET 0.024 0.60mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.050 1.27mm QFP PLCC FR4 Epoxy Glass
24-650000-10-P 24-650000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder Non-RoHS Compliant 24 SOIC Through Hole 3.175mm 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
28-450001-11-RC 28-450001-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 450001 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant 28 SOCKET ADAPTER Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
232-1285-39-0602J 232-1285-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 Gold Straight 32 RoHS Compliant Lead Free Copper Gold No 32 Through Hole -55°C~125°C 2 Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
97-56001-P 97-56001-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 97-56001 Active 1 (Unlimited) Solder Gold 132 Non-RoHS Compliant 169 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
18-665000-00 18-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
290-1294-29-0602J 290-1294-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 90 150°C -55°C Female Gold 90 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 90 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
24-350000-10-HT 24-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 8 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 no Active 1 (Unlimited) Solder EAR99 Tin 24 Non-RoHS Compliant 24 SOCKET ADAPTER Through Hole 3.175mm e0 High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
28-352000-10 28-352000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole RYTON 2007 Correct-A-Chip® 352000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 28 Non-RoHS Compliant 1A 28 Through Hole 3.175mm e3 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
18-354000-21-RC 18-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 Gold 3A 18 Surface Mount 2.286mm 3A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
20-354W00-10 20-354W00-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 20 25.4mm ROHS3 Compliant Lead Free 20 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
14-665000-00 14-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder 14 Non-RoHS Compliant 14 SOIC Surface Mount 787.4μm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
14-651000-10 14-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 14 Non-RoHS Compliant 1A 14 SOCKET ADAPTER Through Hole 3.683mm e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
18-35W000-11-RC 18-35W000-11-RC Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 18 ROHS3 Compliant 18 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
84-653000-10 84-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 84 Non-RoHS Compliant Contains Lead Tin 1A 84 UL 94V-0 6.08mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
52-505-110 52-505-110 Aries Electronics 0.0000
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0.00000000 download 2006 Correct-A-Chip® 505 Obsolete Not Applicable Solder EAR99 52 22.2mm Non-RoHS Compliant Lead Free 52 SOCKET ADAPTER 1.58mm Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
28-652000-10 28-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2011 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 28 Non-RoHS Compliant Lead Free Tin 1A 28 UL 94V-0 1.58mm Through Hole e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
44-505-110 44-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 44 Non-RoHS Compliant 44 SOCKET ADAPTER Through Hole 3.81mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
95-132I25 95-132I25 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 95-132I25 Active 1 (Unlimited) Solder 95 EAR99 Tin 132 34.3mm Non-RoHS Compliant Contains Lead 132 SOCKET ADAPTER 2.39mm Through Hole e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
1107254-28 1107254-28 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 35.6mm ROHS3 Compliant Lead Free Copper SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 3A UL94 V-0 15.24 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
800-3-6-1 800-3-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
28-651000-11-RC 28-651000-11-RC Aries Electronics 0.0000
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0.00000000 Correct-A-Chip® 651000 Obsolete Not Applicable Solder 28 Through Hole 1A 0.026 0.65mm Gold 10.0μin 0.25μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
28-354000-11-RC 28-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 Copper 3A 28 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
228-1277-09-0602J 228-1277-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
216-3340-09-0602J 216-3340-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) DIP, Socket Solder 16 150°C -55°C Female Gold 16 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 16 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
08-354000-10 08-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 8 Non-RoHS Compliant UL94 V-0 Tin 3A 8 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
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