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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Number of Rows PCB Contact Pattern Contact Style Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material Core Architecture
14-354W00-10 14-354W00-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 14 17.8mm ROHS3 Compliant Lead Free 14 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
800-27-6-1 800-27-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
232-1285-29-0602J 232-1285-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold 32 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 32 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
32-655000-10 32-655000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 655000 Active 1 (Unlimited) Solder EAR99 Silver 32 40.6mm Non-RoHS Compliant Lead Free 32 SOCKET ADAPTER 1.58mm Through Hole e3 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
08-350000-10-HT 08-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks POLYAMIDE 2006 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 8 Non-RoHS Compliant 8 2.54mm Through Hole e0 2 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
32-652000-11-RC 32-652000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 32 ROHS3 Compliant Lead Free 1A 32 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
228-4817-19-0602J 228-4817-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
32-653000-11-RC 32-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 32 ROHS3 Compliant UL94 V-0 Lead Free 1A 32 UL 94V-0 No SVHC Through Hole 3.175mm e4 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
216-3340-19-0602J 216-3340-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 16 150°C -55°C Female Gold 16 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 16 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
28-505-111 28-505-111 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 GOLD (10) 28 Non-RoHS Compliant 28 SOCKET ADAPTER Through Hole 3.81mm e4 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
28-650000-11-RC-P 28-650000-11-RC-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant Gold 28 Through Hole 3.175mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
LCQT-QFP0.5-60 LCQT-QFP0.5-60 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 60 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
800-37-6-1 800-37-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
MIKROE-230 MIKROE-230 MikroElektronika 0.0000
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0.00000000 4 Weeks Socket Active 1 (Unlimited) Non-RoHS Compliant 40 AT90PWM1 DIP AVR
20-354000-11-RC 20-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 Copper 3A 20 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
DS9075-40V/NO-BRAND DS9075-40V/NO-BRAND Maxim Integrated 0.0000
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0.00000000 download Bulk 2001 DS9075 Obsolete 1 (Unlimited) Non-RoHS Compliant Contains Lead 40 SIP DIP
24-651000-10 24-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 36 Non-RoHS Compliant 1A 24 SOCKET ADAPTER Through Hole 3.683mm e0 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
16-35W000-11-RC 16-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2008 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 16 ROHS3 Compliant Lead Free 16 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
68-652000-10 68-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 68 Non-RoHS Compliant Tin 1A 68 UL 94V-0 Through Hole 3.175mm e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
16-651000-10 16-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 16 Non-RoHS Compliant 1A 16 SOCKET ADAPTER Through Hole 3.683mm e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
84-505-110 84-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 84 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
LCQT-QFP0.5-80 LCQT-QFP0.5-80 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 80 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
1106396-24 1106396-24 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 2 RECTANGULAR RND PIN-SKT 3A UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
44-647-10 44-647-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Bulk 2002 647 Active 1 (Unlimited) Solder EAR99 Gold 44 69.9mm Non-RoHS Compliant Contains Lead 44 UL 94V-0 2.39mm Through Hole e4 3A IC SOCKET Tin 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Phosphor Bronze 0.180 4.57mm SOIC DIP, 0.6 (15.24mm) Row Spacing
242-1281-09-0602J 242-1281-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 42 150°C -55°C Female Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
28-35W000-11-RC 28-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 28 ROHS3 Compliant Lead Free 28 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.050 1.27mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
14-354000-21-RC 14-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
LCQT-QFP0.65-80 LCQT-QFP0.65-80 0.0000
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0.00000000
1109522 1109522 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1109522 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 8 Non-RoHS Compliant UL94 V-0 3A 8 STANDARD: UL 94V-0 TO-8 2.54mm Through Hole 3.175mm e0 2 UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing JEDEC FR4 Epoxy Glass
32-653000-10 32-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2011 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 32 40.6mm Non-RoHS Compliant Contains Lead 32 UL 94V-0 6.08mm Through Hole e0 Socket Included 1A UL94 V-0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
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