
Items : %s%s
Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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389289 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | 370 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||
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24-6337-7603 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2015 | 275 | Obsolete | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||
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16-5050-0062 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2010 | Solid Core Wire | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn50Pb50 (50/50) | 14 AWG, 16 SWG | Spool, 5 lbs (2.27kg) | Leaded | 361°F~420°F 183°C~216°C | ||||||||
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RASW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 21 AWG, 20 SWG | Spool, 1 oz (28.35g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||
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727190 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C511™ | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 23 AWG, 24 SWG | Spool, 1 lb (454 g) | Lead Free | 440°F~464°F 227°C~240°C | No-Clean | |||||||||
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14-7068-0125 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Solid Core Wire | Active | 1 (Unlimited) | 0.125 3.18mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 8 AWG, 10 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | |||||||||
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SMD2040-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||
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397102 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.048 1.22mm | Non-RoHS Compliant | 1.1lbs 499g | Wire Solder | 59°F~86°F 15°C~30°C | Sn63Pb37 (63/37) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||
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412183 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | 2000 | C511™ | Active | Not Applicable | 0.040 1.02mm | Non-RoHS Compliant | Wire Solder | 59°F~86°F 15°C~30°C | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | ||||||||
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4894-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4890 | Active | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | 0.5lb 226.8g | 22 AWG | Wire Solder | Sn60Pb40 (60/40) | 22 AWG, 23 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F~376°F 183°C~191°C | Rosin Activated (RA) | ||||||
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SS-S020AS | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||
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14-7070-0031 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2007 | Solid Core Wire | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Ag5 (95/5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~473°F 221°C~245°C | ||||||||
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1371245 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | LF620M | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | Cartridge, 17.64 oz (500g) | Lead Free | No-Clean | ||||||||||||||
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662727 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | MP218 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Leaded | No-Clean | |||||||||||
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1844657 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | HF212 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | Jar, 21.16 oz (600g) | Lead Free | 410°F~424°F 209°C~218°C | No-Clean | |||||||||||
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NC191AX50T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | ||||||||||
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92-7068-6416 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 331 | Active | 1 (Unlimited) | 0.025 0.64mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | |||||||||
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24-7068-9831 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.031 0.79mm | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||
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389261 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | 370 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | 0.551lb 249.93g | 26 AWG | Wire Solder | Sn60Pb40 (60/40) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||
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SSLFNC-T5-250G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||
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70-0102-0511 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Cartridge | Profile®, 256 | Active | Not Applicable | Non-RoHS Compliant | 1.3lbs 589.7g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | Leaded | 361°F 183°C | No-Clean | |||||||
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26-4060-0066 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.093 2.36mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Pb60Sn40 (60/40) | 11 AWG, 13 SWG | Spool, 5 lbs (2.27kg) | Leaded | 361°F~460°F 183°C~238°C | Rosin Activated (RA) | |||||||
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TS391SNL10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||
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24-6337-7403 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2005 | 282 | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||
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SMDSW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | 0.062lb 28.12g | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 oz (28.35g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | |||||||||
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WBNCC633732 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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70-1002-0310 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | HydroMark 531 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn62Pb36Ag2 (62/36/2) | Jar, 17.64 oz (500g) | Leaded | 354°F 179°C | Water Soluble | ||||||||||
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24-7050-0039 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 44 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | RoHS Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.3Ag3.7 (96.3/3.7) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~444°F 221°C~223°C | Rosin Activated (RA) | ||||||||
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4884-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4880 | Active | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | 0.5lb 226.8g | 22 AWG | Wire Solder | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||
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SMDSW.015 100G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 3.53 oz (100g) | Leaded | 361°F 183°C | No-Clean, Water Soluble |