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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | REACH SVHC | Height | Width | Outside Diameter | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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24-6337-9713 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 285 | Active | Not Applicable | 0.031 0.79mm | 82.55mm | Non-RoHS Compliant | Contains Lead | 63.5mm | 82.55mm | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||
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92-7068-8803 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.062 1.57mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||||
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24-6337-8809 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 245 | Active | 1 (Unlimited) | 0.025 0.64mm | Non-RoHS Compliant | Contains Lead | Unknown | 1lb 453.59g | 22 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||
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TS391AX | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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24-6040-9709 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Mildly Activated (RMA) | ||||||||||||||
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OS-S020AS | MENDA/EasyBraid | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | 24 AWG | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||||
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24-6040-9711 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Mildly Activated (RMA) | ||||||||||||||
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NC191LT50T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||||
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70-0902-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | FL250D | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||||
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24-6337-7415 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 282 | Active | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Contains Lead | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||||||
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721472 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 2.65 oz (75g) | Lead Free | 423°F 217°C | No-Clean | ||||||||||||||||||
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24-6337-6422 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 331 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Contains Lead | 015 | Unknown | 381 μm | 1lb 453.59g | 26 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | ||||||||
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TS391SNL250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||||||||
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733010 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | C511™ | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | ||||||||||||||||||
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SMDLTLFP10T5 | Chip Quik Inc. | 25.7828 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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389289 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | 370 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||||||
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49500-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2016 | 49500 | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | 65°F~80°F 18°C~27°C | Sn99.5Cu0.5 (99.5/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 442°F 228°C | No-Clean | ||||||||||||||
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TS991AX500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||||
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24-6337-9703 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2007 | 285 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Contains Lead | 015 | 1lb 453.59g | 26 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||
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07-7033-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | ULTRAPURE® | Active | 1 (Unlimited) | ROHS3 Compliant | Bar Solder | Sn97Ag3 (97/3) | Bar, 5 lbs (2.27kg) | Lead Free | 430°F~435°F 221°C~224°C | ||||||||||||||||||||
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SMD3SW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||||||||
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91-7068-7604 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||||
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70-4105-0810 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | NP545 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||||
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24-7068-8846 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 245 | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||
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17554 | Aven Tools | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Spool | 2009 | Obsolete | Not Applicable | 0.030 0.76mm | Non-RoHS Compliant | 0.551lb 249.93g | Wire Solder | Sn60Pb40 (60/40) | 21 AWG, 22 SWG | Spool, 8.8 oz (250g) | Leaded | 360°F 180°C | Rosin Activated (RA) | ||||||||||||||||
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BARSN42BI57AG1-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn42Bi57Ag1 (42/57/1) | Bar, 0.5 lb (227g) | Lead Free | 280°F 138°C | ||||||||||||||||||||
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SMDSWLF.015 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||||
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4901-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2006 | 4901 | Active | Not Applicable | 0.032 0.81mm | ROHS3 Compliant | Lead Free | 0.25lb 113.4g | 20 AWG | Wire Solder | 65°F~80°F 18°C~27°C | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Spool, 4 oz (113.40g) | Lead Free | 442°F 227°C | No-Clean | |||||||||||
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92-6337-7603 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.020 0.51mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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WBRC9645 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.062 1.57mm | RoHS Compliant | Wire Solder | Sn96Ag4 (96/4) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | Rosin Activated (RA) |
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SMDLTLFP10T5 Chip Quik Inc.
SMDLTLFP10T5 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 25.7828
RFQ -
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TS991AX500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar)
Price: 0.0000
RFQ -
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