Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | REACH SVHC | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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04-7068-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Solder | Bar | 2007 | ULTRAPURE® | Active | Not Applicable | ROHS3 Compliant | Lead Free | Unknown | 1.7lbs 771.1g | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 1.66 lbs (750g) | Lead Free | 423°F~424°F 217°C~218°C | |||||||||
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SMD16/291 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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24-6337-7601 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2012 | 275 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||
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TS991AX35T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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SMD2060 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.030 0.76mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||
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24-7031-0053 | Kester | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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24-6337-7602 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Solder | Spool | 2005 | 275 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||
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SMD3SW.015 100G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 27 AWG, 28 SWG | Spool, 3.53 oz (100g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||
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28-5050-0654 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | OR421 | Active | 1 (Unlimited) | 0.062 1.57mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn50Pb50 (50/50) | 14 AWG, 16 SWG | Spool, 20 lbs (9.07kg) | Leaded | 361°F~420°F 183°C~216°C | Water Soluble | ||||||||||||
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673831 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.048 1.22mm | RoHS Compliant | 0.55lb 249.48g | 16 AWG | Wire Solder | 59°F~86°F 15°C~30°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | |||||||
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90-7068-8850 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.010 0.25mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 30 AWG, 33 SWG | Spool, 3.53 oz (100g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||
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SMD291SNL500T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||
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24-7068-7615 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.062 1.57mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||
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NC191AX250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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70-0202-0610 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EP256HA | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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673829 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.032 0.81mm | RoHS Compliant | 0.55lb 249.48g | 20 AWG | Wire Solder | 59°F~86°F 15°C~30°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean |
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TS991AX35T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (35g syringe)
Price: 0.0000
RFQ -
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28-5050-0654 Kester Solder
28-5050-0654 datasheet pdf and Solder product details from Kester Solder stock available at Utmel
Price: 0.0000
RFQ -
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