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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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SMD2SW.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 4 oz (113.40g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||||
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NC4SW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 565°F~574°F 296°C~301°C | No-Clean | |||||||||||
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SMD2200 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||
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SMD2060-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.030 0.76mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||
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TS391AX250 | Chip Quik Inc. | 44.3050 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | |||||||||
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SMD291AX50T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | 0.113lb 51.26g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | |||||||
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NC2SW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean | |||||||||||
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SMD3SW.031 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||
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SMD291SNL500T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||
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SMDSWLT.040 50G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.040 1.02mm | ROHS3 Compliant | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 18 AWG, 19 SWG | Spool, 1.8 oz (50g) | Lead Free | 280°F 138°C | No-Clean, Rosin Activated (RA) | ||||||||||
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SMDSWLF.020 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | 0.125lb 56.7g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 2 oz (56.70g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||
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NC191AX250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | ||||||||||
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SMD2024-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.012 0.31mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||
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NC191AX15 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | Leaded | 361°F 183°C | No-Clean | |||||||||
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RASWLF.020 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 2 oz (56.70g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||
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SMD2SW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||
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SMD3SW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||
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SMDSWLF.031 .7OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||
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721440 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | No-Clean | |||||||||||
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SMDSWLF.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Tube, 0.4 oz (11.34g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||
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CQ100GE 250G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Jar, 8.8 oz (250g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||
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04-0015-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | Bar Solder | Pb97.5Ag1.5Sn1 (97.5/1.5/1) | Bar, 1.66 lbs (750g) | Leaded | 588°F 309°C | |||||||||||||||
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1354250 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | WS300 | Not For New Designs | Not Applicable | RoHS Compliant | Solder Paste | 35.6°F~46.4°F 2°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 2.65 oz (75g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||
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SMDSWLF.015 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||
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SS-S020AS | MENDA/EasyBraid | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | 24 AWG | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool | Leaded | 361°F 183°C | Water Soluble | ||||||||||||
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SMDSWLT.047 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||
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24-7068-0010 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | ||||||||
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OS-S020AS | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||
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24-7031-0053 | Kester | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||
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NC3SWLF.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | No-Clean |
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TS391AX250 Chip Quik Inc.
TS391AX250 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 44.3050
RFQ -
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NC191AX15 Chip Quik Inc.
NC191AX15 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
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CQ100GE 250G Chip Quik Inc.
CQ100GE 250G datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
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OS-S020AS Easy Braid Co
OS-S020AS datasheet pdf and Solder product details from Easy Braid Co stock available at HK JDW
Price: 0.0000
RFQ -
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