 
            Items : %s%s
SoC
Additional Feature
-                               ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
-                               ALSO OPERATES AT 0.85V
-                               ALSO OPERATES AT 0.92-0.98 V SUPPLY
-                               ALSO OPERATES WITH 0.85 VOLT
-                               GPIO WITH FOUR 32-BIT BANKS
-                               IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
-                               IT ALSO OPERATES AT 0.95V NOMINAL VCC
-                               LG-MIN, WD-MIN
-                               LG-MIN,WD-MIN
-                               PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Contact Plating
-                               Copper, Silver, Tin
ECCN Code
-                               3A001.A.2.C
-                               3A991
-                               3A991.D
-                               EAR99
Factory Lead Time
-                               1 Weeks
-                               10 Weeks
-                               11 Weeks
-                               12 Weeks
-                               13 Weeks
-                               14 Weeks
-                               15 Weeks
-                               16 Weeks
-                               2 Weeks
-                               22 Weeks
-                               25 Weeks
-                               26 Weeks
-                               3 Weeks
-                               4 Weeks
-                               5 Weeks
-                               6 Weeks
-                               7 Weeks
-                               8 Weeks
-                               9 Weeks
-                               99 Weeks
HTS Code
-                               8542.31.00.01
-                               8542.39.00.01
JESD-609 Code
-                               e0
-                               e1
-                               e3
Lifecycle Status
-                               IN PRODUCTION (Last Updated: 1 month ago)
-                               IN PRODUCTION (Last Updated: 2 days ago)
-                               IN PRODUCTION (Last Updated: 2 weeks ago)
-                               IN PRODUCTION (Last Updated: 3 days ago)
-                               IN PRODUCTION (Last Updated: 3 weeks ago)
-                               OBSOLETE (Last Updated: 1 month ago)
-                               OBSOLETE (Last Updated: 2 days ago)
-                               OBSOLETE (Last Updated: 3 weeks ago)
Max Operating Temperature
-                               100°C
-                               125°C
-                               85°C
Min Operating Temperature
-                               -40°C
-                               -55°C
-                               0°C
Moisture Sensitivity Level (MSL)
-                               1 (Unlimited)
-                               1 (Unlimited)
-                               2A (4 Weeks)
-                               3
-                               3 (168 Hours)
-                               3 (168 Hours)
-                               4 (72 Hours)
-                               Not Applicable
Mount
-                               Surface Mount
Number of Pins
-                               1152
-                               1156
-                               144
-                               2
-                               208
-                               225
-                               256
-                               288
-                               325
-                               400
-                               484
-                               485
-                               676
-                               896
-                               900
Number of Terminals
-                               1517
Number of Terminations
-                               1152
-                               144
-                               208
-                               225
-                               256
-                               288
-                               325
-                               400
-                               484
-                               485
-                               536
-                               625
-                               672
-                               676
-                               780
-                               784
-                               896
-                               900
Operating Temperature
-                               -30°C~85°C
-                               -40°C~100°C TJ
-                               -40°C~125°C TJ
-                               -40°C~85°C
-                               -55°C~125°C TJ
-                               0°C~100°C TJ
-                               0°C~85°C TJ
Package / Case
-                               100-LQFP
-                               1152-BBGA, FCBGA
-                               1156-BBGA, FCBGA
-                               144-LQFP
-                               1517-BBGA, FCBGA
-                               1760-BBGA, FCBGA
-                               1924-BBGA, FCBGA
-                               208-BFQFP
-                               225-LFBGA, CSPBGA
-                               2397-BBGA, FCBGA
-                               256-LBGA
-                               256-LFBGA
-                               288-TFBGA, CSPBGA
-                               2912-BBGA, FCBGA
-                               325-TFBGA, CSPBGA
-                               400-LFBGA
-                               400-LFBGA, CSPBGA
-                               449-BGA
-                               484-BBGA, FCBGA
-                               484-BFBGA
-                               484-BFBGA, FCBGA
-                               484-BGA
-                               484-FBGA
-                               484-FBGA, FCBGA
-                               484-LFBGA, CSPBGA
-                               536-LFBGA, CSPBGA
-                               625-BFBGA, FCBGA
-                               64-LQFP
-                               672-BBGA, FCBGA
-                               672-FBGA
-                               676-BBGA, FCBGA
-                               676-BGA
-                               780-BBGA, FCBGA
-                               784-BFBGA, FCBGA
-                               896-BBGA, FCBGA
-                               896-BGA
-                               900-BBGA, FCBGA
-                               BGA
-                               Module
Packaging
-                               Bulk
-                               Tape & Reel (TR)
-                               Tray
-                               Tube
Part Status
-                               Active
-                               Discontinued
-                               Obsolete
Pbfree Code
-                               no
-                               yes
Peak Reflow Temperature (Cel)
-                               225
-                               235
-                               245
-                               250
-                               260
-                               NOT SPECIFIED
Published
-                               1997
-                               2000
-                               2001
-                               2002
-                               2003
-                               2006
-                               2007
-                               2008
-                               2009
-                               2010
-                               2011
-                               2012
-                               2013
-                               2014
-                               2015
-                               2016
-                               2017
-                               2018
Series
-                               Arria 10 SX
-                               Arria V ST
-                               Arria V SX
-                               Automotive, AEC-Q100, Cyclone® V SE
-                               Automotive, AEC-Q100, SmartFusion®2
-                               Automotive, AEC-Q100, Zynq®-7000 XA
-                               BCM7405
-                               Cyclone® V SE
-                               Cyclone® V ST
-                               Cyclone® V SX
-                               Sipeed MAIX-I
-                               SmartFusion®
-                               SmartFusion®2
-                               Stratix® 10 SX
-                               Zynq® UltraScale+™ MPSoC CG
-                               Zynq® UltraScale+™ MPSoC EG
-                               Zynq® UltraScale+™ MPSoC EV
-                               Zynq®-7000
Subcategory
-                               Field Programmable Gate Arrays
-                               Other Microprocessor ICs
-                               Other uPs/uCs/Peripheral ICs
Supplier Device Package
-                               1152-FBGA, FC (35x35)
-                               1152-FCBGA (35x35)
-                               144-TQFP (20x20)
-                               1517-FBGA, FC (40x40)
-                               1517-FCBGA (40x40)
-                               208-PQFP (28x28)
-                               256-FPBGA (17x17)
-                               288-CSP (11x11)
-                               325-CSPBGA (11x11)
-                               400-CSPBGA (17x17)
-                               400-VFBGA (17x17)
-                               484-CSPBGA (19x19)
-                               484-FBGA (19x19)
-                               484-FCBGA (19x19)
-                               484-FPBGA (23x23)
-                               485-CSBGA (19x19)
-                               485-FCBGA (19x19)
-                               672-UBGA (23x23)
-                               676-FBGA (27x27)
-                               676-FCBGA (27x27)
-                               784-FCBGA (23x23)
-                               896-FBGA (31x31)
-                               900-FCBGA (31x31)
Surface Mount
-                               YES
Technology
-                               CMOS
Terminal Finish
-                               MATTE TIN
-                               Matte Tin (Sn)
-                               Pure Matte Tin (Sn)
-                               TIN LEAD
-                               TIN LEAD SILVER
-                               TIN LEAD/TIN LEAD SILVER
-                               TIN SILVER COPPER
-                               Tin/Lead (Sn/Pb)
-                               Tin/Lead/Silver (Sn/Pb/Ag)
-                               Tin/Silver/Copper (Sn/Ag/Cu)
-                               Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
-                               BALL
-                               GULL WING
Terminal Position
-                               BOTTOM
-                               QUAD
Weight
-                               1.319103g
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Frequency | Width | Operating Temperature | Technology | Operating Supply Current | Height Seated (Max) | HTS Code | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Number of Outputs | Data Rate | Supplier Device Package | Core Architecture | Speed | Number of Inputs | Memory Size | Core Processor | RAM Size | Number of I/O | Organization | Boundary Scan | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | Clock Frequency | RAM (words) | Number of Gates | Primary Attributes | Number of Logic Elements/Cells | Programmable Logic Type | Number of Logic Cells | Number of Registers | Number of Equivalent Gates | Flash Size | Connectivity | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|  | 10AS022C3U19I2LG | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 8 Weeks | Tray | Arria 10 SX | Active | 3 (168 Hours) | 484 | 19mm | RoHS Compliant | 484-BFBGA | 19mm | -40°C~100°C TJ | CMOS | 3.25mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B484 | 0.87V | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 192 | 1.5GHz | 192 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 192 | MCU, FPGA | DMA, POR, WDT | FPGA - 220K Logic Elements | FIELD PROGRAMMABLE GATE ARRAY | 220000 | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||
| .png) | 5ASXMB3E4F31I5G | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | Active | 3 (168 Hours) | RoHS Compliant | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| .png) | BCM3380ZIFSBG | Broadcom | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | Obsolete | 1 (Unlimited) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | 10AS027H3F34E2SG | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 8 Weeks | Tray | Arria 10 SX | Active | 3 (168 Hours) | 35mm | RoHS Compliant | 1152-BBGA, FCBGA | 35mm | 0°C~100°C TJ | CMOS | 3.65mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | YES | 1mm | S-PBGA-B1152 | 0.87V | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 384 | 1.5GHz | 384 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 384 | MCU, FPGA | DMA, POR, WDT | FPGA - 270K Logic Elements | FIELD PROGRAMMABLE GATE ARRAY | 270000 | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||
|  | A2F500M3G-FGG256 | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 12 Weeks | Tray | 2013 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 1.5V | RoHS Compliant | Lead Free | 256 | 256-LBGA | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 0°C~85°C TJ | 16.5mA | 100MHz | A2F500M3G | 400 kbps | 256-FPBGA (17x17) | ARM | 80MHz | 13.5kB | ARM® Cortex®-M3 | 64KB | MCU - 25, FPGA - 66 | MCU, FPGA | DMA, POR, WDT | 500000 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 5500 | 512KB | EBI/EMI, Ethernet, I2C, SPI, UART/USART | |||||||||||||||||||||||||||||||||||||||||
|  | XCZU11EG-L2FFVC1156E | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 1156-BBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B1156 | 0.698V | 0.742V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 360 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||
|  | M2S050-1FCSG325I | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 325 | 3A991.D | 11mm | RoHS Compliant | Lead Free | LG-MIN, WD-MIN | 325-TFBGA, CSPBGA | 11mm | -40°C~100°C TJ | CMOS | 1.01mm | 8542.39.00.01 | e3 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 0.5mm | S-PBGA-B325 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 200 | 166MHz | 200 | ARM® Cortex®-M3 | 64KB | 200 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 50K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||
| .png) | 1SX085HN1F43I2VG | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 12 Weeks | Stratix® 10 SX | Active | 3 (168 Hours) | 1760-BBGA, FCBGA | -40°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | MCU, FPGA | DMA, WDT | FPGA - 850K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | M2S050T-1FCSG325 | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 325 | 11mm | RoHS Compliant | LG-MIN, WD-MIN | 325-TFBGA, CSPBGA | 11mm | 0°C~85°C TJ | CMOS | 1.01mm | 8542.39.00.01 | e3 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 0.5mm | S-PBGA-B325 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 200 | 166MHz | 200 | ARM® Cortex®-M3 | 64KB | 200 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 50K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||||||
|  | XCZU5EV-L2SFVC784E | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 784-BFBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B784 | 0.698V | 0.742V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||
|  | A2F500M3G-1CS288I | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 12 Weeks | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 288 | 11mm | Non-RoHS Compliant | 288-TFBGA, CSPBGA | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 11mm | -40°C~100°C TJ | CMOS | 1.05mm | 8542.39.00.01 | e0 | TIN LEAD SILVER | BOTTOM | BALL | 235 | 1.5V | 20 | A2F500M3G | YES | 0.5mm | S-PBGA-B288 | 1.425V | Field Programmable Gate Arrays | Not Qualified | 1.51.82.53.3V | 1.575V | 78 | ARM | 78 | ARM® Cortex®-M3 | 64KB | MCU - 31, FPGA - 78 | 11520 CLBS, 500000 GATES | MCU, FPGA | DMA, POR, WDT | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 512KB | EBI/EMI, Ethernet, I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||
|  | M2S025TS-FG484 | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 484 | 23mm | Non-RoHS Compliant | 484-BGA | not_compliant | 23mm | 0°C~85°C TJ | CMOS | 2.44mm | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 1mm | S-PBGA-B484 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 267 | 166MHz | 267 | ARM® Cortex®-M3 | 64KB | 267 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 25K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||||||
|  | 5CSEBA2U23I7LN | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 15 Weeks | Tray | 2018 | Cyclone® V SE | Active | 672-FBGA | compliant | -40°C~100°C TJ | 925MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 64KB | MCU - 181, FPGA - 145 | MCU, FPGA | DMA, POR, WDT | FPGA - 25K Logic Elements | FIELD PROGRAMMABLE GATE ARRAY | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | XC7Z012S-2CLG485E | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 485 | 19mm | ROHS3 Compliant | 484-LFBGA, CSPBGA | 19mm | 0°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B485 | 0.95V | 1.05V | 766MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 150 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 800MHz | 256000 | Artix™-7 FPGA, 55K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||
|  | M2S090TS-FG676I | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 676 | 27mm | Non-RoHS Compliant | 676-BGA | not_compliant | 27mm | -40°C~100°C TJ | CMOS | 2.44mm | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 1mm | S-PBGA-B676 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 425 | 166MHz | 425 | ARM® Cortex®-M3 | 64KB | 425 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 90K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 512KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||
| .png) | 1SX250LN3F43E3XG | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 8 Weeks | Stratix® 10 SX | Active | 3 (168 Hours) | 1760-BBGA, FCBGA | compliant | 0°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | FPGA - 2500K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | M2S050T-1FCSG325I | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 325 | 11mm | RoHS Compliant | LG-MIN, WD-MIN | 325-TFBGA, CSPBGA | 11mm | -40°C~100°C TJ | CMOS | 1.01mm | 8542.39.00.01 | e3 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 0.5mm | S-PBGA-B325 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 200 | 166MHz | 200 | ARM® Cortex®-M3 | 64KB | 200 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 50K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||||||
|  | M2S005S-1VF400 | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | Non-RoHS Compliant | 400-LFBGA | 0°C~85°C TJ | 400-VFBGA (17x17) | 166MHz | ARM® Cortex®-M3 | 64KB | 169 | MCU, FPGA | DDR | FPGA - 5K Logic Modules | 128KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | M2S025S-1VF400I | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | Tray | 2016 | SmartFusion®2 | Obsolete | 3 (168 Hours) | 100°C | -40°C | Non-RoHS Compliant | 400 | 400-LFBGA | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | -40°C~100°C TJ | M2S025S | 400-VFBGA (17x17) | ARM | 166MHz | ARM® Cortex®-M3 | 64KB | 207 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 25K Logic Modules | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | XCZU7CG-2FFVC1156I | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 1156-BBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | R-PBGA-B1156 | 0.825V | 0.876V | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 360 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||
|  | M2S150TS-1FC1152I | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 35mm | Non-RoHS Compliant | 1152-BBGA, FCBGA | CAN, Ethernet, I2C, SPI, UART, USART, USB | not_compliant | 166MHz | 35mm | -40°C~100°C TJ | CMOS | 2.9mm | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | M2S150TS | YES | 1mm | S-PBGA-B1152 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 574 | ARM | 574 | ARM® Cortex®-M3 | 64KB | 574 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 150K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 512KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||||
| .png) | 5ASXBB3D4F31I5G | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | Active | 3 (168 Hours) | RoHS Compliant | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | XCZU2CG-L2SFVC784E | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 784-BFBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | S-PBGA-B784 | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||
| .png) | XCZU19EG-2FFVE1924I | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 1924-BBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 668 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | 10AS057H2F34E2SG | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 8 Weeks | Tray | Arria 10 SX | Active | 3 (168 Hours) | 35mm | RoHS Compliant | 1152-BBGA, FCBGA | 35mm | 0°C~100°C TJ | CMOS | 3.65mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | YES | 1mm | S-PBGA-B1152 | 0.87V | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 492 | 1.5GHz | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 492 | MCU, FPGA | DMA, POR, WDT | FPGA - 570K Logic Elements | FIELD PROGRAMMABLE GATE ARRAY | 570000 | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||
| .png) | BCM1125HA4K800G | Broadcom | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | Obsolete | 1 (Unlimited) | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | 10AS027E3F27E2SG | Intel | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 8 Weeks | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 27mm | RoHS Compliant | 672-BBGA, FCBGA | 27mm | 0°C~100°C TJ | CMOS | 3.25mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | YES | 1mm | S-PBGA-B672 | 0.87V | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 240 | 1.5GHz | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 240 | MCU, FPGA | DMA, POR, WDT | FPGA - 270K Logic Elements | FIELD PROGRAMMABLE GATE ARRAY | 270000 | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||
| .png) | XCZU19EG-2FFVB1517I | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 1517-BBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 644 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | XCZU9CG-1FFVB1156E | Xilinx | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 1156-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 328 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|  | A2F200M3F-FGG256 | Microsemi | 0.0000 | Min: 1 Mult: 1 | 0.00000000 | download | 12 Weeks | Tray | 2011 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 1.5V | RoHS Compliant | No | 256 | 256-LBGA | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 0°C~85°C TJ | 7mA | 100MHz | A2F200 | 400 kbps | 256-FPBGA (17x17) | ARM | 80MHz | 4.5kB | ARM® Cortex®-M3 | 64KB | MCU - 25, FPGA - 66 | MCU, FPGA | DMA, POR, WDT | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 2500 | 4608 | 256KB | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 
- 
                10AS022C3U19I2LG Intel484 Terminations-40°C~100°C TJ System On ChipArria 10 SX Series 192 I/O0.9V Price: 0.0000 RFQ
- 
                
- 
                
- 
                10AS027H3F34E2SG Intel0°C~100°C TJ System On Chip Arria 10 SX Series 384 I/O 0.9V Price: 0.0000 RFQ
- 
                A2F500M3G-FGG256 Microsemi0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V Price: 0.0000 RFQ
- 
                XCZU11EG-L2FFVC1156E Xilinx0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O0.72V Price: 0.0000 RFQ
- 
                M2S050-1FCSG325I Microsemi325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V Price: 0.0000 RFQ
- 
                
- 
                M2S050T-1FCSG325 Microsemi325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V Price: 0.0000 RFQ
- 
                XCZU5EV-L2SFVC784E Xilinx784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 252 I/O0.72V Price: 0.0000 RFQ
- 
                A2F500M3G-1CS288I Microsemi288 Terminations-40°C~100°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V Price: 0.0000 RFQ
- 
                M2S025TS-FG484 Microsemi484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V Price: 0.0000 RFQ
- 
                5CSEBA2U23I7LN Intel-40°C~100°C TJ System On ChipCyclone? V SE Series MCU - 181, FPGA - 145 I/O Price: 0.0000 RFQ
- 
                XC7Z012S-2CLG485E Xilinx485 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 150 I/O1V Price: 0.0000 RFQ
- 
                M2S090TS-FG676I Microsemi676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V Price: 0.0000 RFQ
- 
                
- 
                M2S050T-1FCSG325I Microsemi325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V Price: 0.0000 RFQ
- 
                
- 
                M2S025S-1VF400I Microsemi-40°C~100°C TJ 400 Pin M2S025S System On ChipSmartFusion?2 Series 207 I/O Price: 0.0000 RFQ
- 
                XCZU7CG-2FFVC1156I Xilinx-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 360 I/O0.85V Price: 0.0000 RFQ
- 
                M2S150TS-1FC1152I Microsemi-40°C~100°C TJ M2S150TS System On ChipSmartFusion?2 Series 574 I/O1.2V Price: 0.0000 RFQ
- 
                
- 
                XCZU2CG-L2SFVC784E Xilinx784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.72V Price: 0.0000 RFQ
- 
                XCZU19EG-2FFVE1924I Xilinx-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O Price: 0.0000 RFQ
- 
                
- 
                
- 
                10AS027E3F27E2SG Intel672 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 240 I/O0.9V Price: 0.0000 RFQ
- 
                XCZU19EG-2FFVB1517I Xilinx-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O Price: 0.0000 RFQ
- 
                XCZU9CG-1FFVB1156E Xilinx0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O Price: 0.0000 RFQ
- 
                A2F200M3F-FGG256 Microsemi0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V Price: 0.0000 RFQ


 Need Help?
        Need Help?
    

 
                                 
                                 
                                 
                                         
                                         
                                         
                                         
                                         
                                    