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M2S090TS-FGG676I

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Manufacturer No:

M2S090TS-FGG676I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S090TS-FGG676I

Package:

676-BGA

Datasheet:

M2S090TS-FGG676I

Description:

676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V

Quantity:

In Stock : 999

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This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 676-BGA package.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 425 inputs and outputs.Use a power supply with a voltage of 1.2V if possible.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supplies of at least 1.14V are required.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 676 terminations, so system on a chip is really aided by this.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.In order for this SoC chip to work properly, you can have 425 outputs.This system on chip SoC requires 1.2V power supply at all.There are 425 inputs available on the SoC chip.There are 86316 logic cells in the logic system on chips.The flash size of the SoC meaning is 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S090TS-FGG676I System On Chip (SoC) applications.

  • ARM processors
  • Digital Media
  • Functional safety for critical applications in the aerospace
  • ARM support modules
  • Central alarm system
  • Body control module
  • Temperature Sensors
  • Transmitters
  • ARM
  • Keywords
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S090TS-FGG676I

technical specifications, attributes, parameters and parts with similar specifications to M2S090TS-FGG676I.

  • Type
    Parameter
    Select All
  • Architecture

    MCU, FPGA

  • Number of Inputs

    425

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 90K Logic Modules

  • Number of Logic Cells

    86316

  • Flash Size

    512KB

  • Height Seated (Max)

    2.44mm

  • Length

    27mm

  • Width

    27mm

  • RoHS Status

    RoHS Compliant

  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 3 weeks ago)

  • Package / Case

    676-BGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®2

  • JESD-609 Code

    e3

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    676

  • Terminal Finish

    MATTE TIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1mm

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B676

  • Number of Outputs

    425

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    425

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

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