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M2S150T-FCV484I

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Manufacturer No:

M2S150T-FCV484I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S150T-FCV484I

Package:

484-BFBGA

Datasheet:

M2S150T-FCV484I

Description:

484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 484-BFBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 150K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 273.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, voltages above 1.26V are considered unsafe.If it has at least a 1.14V volt power supply, it can work fine.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.As a result, there are 484 terminations in total, which does really benefit system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 273 outputs.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 273 inputs available for use.A logic SoC has 146124 logic cells.A 512KB flash can be seen on it.Additionally, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S150T-FCV484I System On Chip (SoC) applications.

  • Body control module
  • Smart appliances
  • Wireless networking
  • String inverter
  • Level
  • Measurement tools
  • Healthcare
  • Microcontroller
  • Wireless sensor networks
  • Efficient hardware for inference of neural networks
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S150T-FCV484I

technical specifications, attributes, parameters and parts with similar specifications to M2S150T-FCV484I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 1 month ago)

  • Package / Case

    484-BFBGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®2

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    484

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Additional Feature

    LG-MIN, WD-MIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    0.8mm

  • Reach Compliance Code

    not_compliant

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B484

  • Number of Outputs

    273

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    273

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    273

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 150K Logic Modules

  • Number of Logic Cells

    146124

  • Flash Size

    512KB

  • Height Seated (Max)

    3.15mm

  • Length

    19mm

  • Width

    19mm

  • RoHS Status

    Non-RoHS Compliant

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