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  • XCZU7EV-3FFVC1156E

XCZU7EV-3FFVC1156E

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Manufacturer No:

XCZU7EV-3FFVC1156E

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU7EV-3FFVC1156E

Package:

1156-BBGA, FCBGA

Description:

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 360 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 1156-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EV.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells is important.A state-of-the-art Tray package houses this SoC system on a chip.360 I/Os in total are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU7EV-3FFVC1156E System On Chip (SoC) applications.

  • Mobile market
  • Industrial
  • Networked sensors
  • Central alarm system
  • String inverter
  • Deep learning hardware
  • System-on-chip (SoC)
  • RISC-V
  • Industrial AC-DC
  • Cyberphysical system-on-chip
1. Purchase

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Tell us the model and quantity you need, our sales staff will reply the price in time.
EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU7EV-3FFVC1156E

technical specifications, attributes, parameters and parts with similar specifications to XCZU7EV-3FFVC1156E.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Package / Case

    1156-BBGA, FCBGA

  • Operating Temperature

    0°C~100°C TJ

  • Packaging

    Tray

  • Published

    2016

  • Series

    Zynq® UltraScale+™ MPSoC EV

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • HTS Code

    8542.31.00.01

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Number of I/O

    360

  • Speed

    600MHz, 1.5GHz

  • RAM Size

    256KB

  • Core Processor

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

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