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XCZU19EG-2FFVD1760I

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Manufacturer No:

XCZU19EG-2FFVD1760I

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU19EG-2FFVD1760I

Package:

1760-BBGA, FCBGA

Description:

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.Internally, this SoC design uses the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.Housed in the state-of-art Tray package.308 I/Os in total are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU19EG-2FFVD1760I System On Chip (SoC) applications.

  • System-on-chip (SoC)
  • Body control module
  • Robotics
  • Cyberphysical system-on-chip
  • Sensor network-on-chip (sNoC)
  • Automated sorting equipment
  • Test and Measurement
  • Industrial AC-DC
  • Central alarm system
  • Microcontroller
1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU19EG-2FFVD1760I

technical specifications, attributes, parameters and parts with similar specifications to XCZU19EG-2FFVD1760I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Package / Case

    1760-BBGA, FCBGA

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2016

  • Series

    Zynq® UltraScale+™ MPSoC EG

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • HTS Code

    8542.31.00.01

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Number of I/O

    308

  • Speed

    533MHz, 600MHz, 1.3GHz

  • RAM Size

    256KB

  • Core Processor

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

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