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XC7Z020-3CLG484E

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Manufacturer No:

XC7Z020-3CLG484E

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z020-3CLG484E

Package:

484-LFBGA, CSPBGA

Datasheet:

XC7Z020-3CLG484E

Description:

484 Terminations0°C~100°C TJ 484 Pin XC7Z020 System On ChipZynq?-7000 Series 130 I/O1V

Quantity:

In Stock : 1288

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.Assigned with the package 484-LFBGA, CSPBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Zynq?-7000 is the series number of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~100°C TJ.A significant feature of this SoC security is the combination of Artix?-7 FPGA, 85K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os in total are included in this SoC part.For safe operation, it is advisable to utilize a power supply with 1V voltage.There is no safe voltage for the SoCs wireless above 1.05V.In total, there are 484 terminations, so system on a chip is really aided by this.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z020.It operates at a frequency of 866MHz.In terms of core architecture, the SoC meaning relies on ARM.There is a 484-pin version of this computer SoC available.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z020-3CLG484E System On Chip (SoC) applications.

  • ARM
  • Measurement tools
  • Cyber security for critical applications in the aerospace
  • Efficient hardware for training of neural networks
  • Body control module
  • Smart appliances
  • Functional safety for critical applications in the aerospace
  • Mobile market
  • Healthcare
  • Digital Media
1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z020-3CLG484E

technical specifications, attributes, parameters and parts with similar specifications to XC7Z020-3CLG484E.

  • Type
    Parameter
    Select All
  • Bus Compatibility

    CAN; ETHERNET; I2C; SPI; UART; USB

  • Height Seated (Max)

    1.6mm

  • Length

    19mm

  • Radiation Hardening

    No

  • RoHS Status

    ROHS3 Compliant

  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Package / Case

    484-LFBGA, CSPBGA

  • Surface Mount

    YES

  • Number of Pins

    484

  • Operating Temperature

    0°C~100°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    Zynq®-7000

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    484

  • ECCN Code

    3A991.D

  • Terminal Finish

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • HTS Code

    8542.39.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    260

  • Supply Voltage

    1V

  • Terminal Pitch

    0.8mm

  • Frequency

    866MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    XC7Z020

  • Operating Supply Voltage

    1V

  • Supply Voltage-Max (Vsup)

    1.05V

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Number of I/O

    130

  • RAM Size

    256KB

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Data Bus Width

    32b

  • Core Architecture

    ARM

  • Boundary Scan

    YES

  • Speed Grade

    -3

  • RAM (words)

    256000

  • Primary Attributes

    Artix™-7 FPGA, 85K Logic Cells

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